2017, Volume 12, Issue 4
Frontiers of Mechanical Engineering >> 2017, Volume 12, Issue 4 doi: 10.1007/s11465-017-0441-2
MEMS-based thermoelectric infrared sensors: A review
Science and Technology on Microsystem Laboratory, Shanghai Institute of Microsystem and Information Technology, CAS, Shanghai 200050, China
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Abstract
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.
Keywords
thermoelectric infrared sensor ; CMOS-MEMS ; thermopile ; micromachining ; wafer-level package
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