Journal Home Online First Current Issue Archive For Authors Journal Information 中文版

2020, Volume 14, Issue 4

Abstract

Keywords

Related Research

Back to Top

Frontiers of Chemical Science and Engineering >> 2020, Volume 14, Issue 4 doi: 10.1007/s11705-019-1829-9

Recent development and application of thin-film thermoelectric cooler

. School of Materials Science and Engineering, Beihang University, Beijing 100083, China.. Beijing Advanced Innovation Center for Biomedical Engineering, Beihang University, Beijing 100083, China

Accepted: 2019-07-19 Available online: 2019-07-19
HTML21 PDF 14 Collect 0

Next Previous

Abstract

Recently, the performance and fabrication of thin-film thermoelectric materials have been largely enhanced. Based on this enhancement, the thin-film thermoelectric cooler (TEC) is becoming a research hot topic, due to its high cooling flux and microchip level size. To fulfill a thin-film TEC, interfacial problems are unavoidable, as they may largely reduce the properties of a thin-film TEC. Moreover, the architecture of a thin-film TEC should also be properly designed. In this review, we introduced the enhancement of thermoelectric properties of (Bi,Sb) (Te,Se) solid solution materials by chemical vapor deposition, physical vapor deposition and electrodeposition. Then, the interfacial problems, including contact resistance, interfacial diffusion and thermal contact resistance, were discussed. Furthermore, the design, fabrication, as well as the performance of thin-film TECs were summarized.

Related Research