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2015, Vol.1, Issue.3

On the cover

Brain-machine interfaces (BMIs) enable users to interact with their environment solely through the power of thought. A variety of tasks elicit specific signatures in brain activity that represent a user’s mental intent in terms of motor control, decision processing, attention, and more.Neural signals from relevant areas of the brain can be recorded during such tasks—either invasively, via microelectrodes or ECoG, or non-invasively, via EEG—and decoded to convey the user’s cognitive state. Through closed-loop visual feedback systems with external devices (e.g., robotic prosthetics), users are provided with a direct representation of their brain output and of the message being conveyed. As training progresses, users can learn to modulate or alter their brain state in order to communicate successfully with the outside world. See page 292.

Guest Editorial Board

Advanced Materials and Materials Genome (2015)

Guest Editors-in-Chief

Tu, Hailing, General Research Institute for Nonferrous Metals, China

Konstantin, Solntsev, Russian Academy of Sciences, Russia

Chen, Liquan, Institute of Physics Chinese Academy of Sciences, China

Kiriakidis, George, University of Crete, E-MRS, IESL, Greece


Members

Alexander, Morgan, The University of Nottingham, UK

Bardin, Billy B., The Dow Chemical Company, USA

Ceder, Gerbrand, Massachusetts Institute of Technology, USA

Cho, Kyeongjae, University of Texas at Dallas, USA

Ginley, David, National Renewable Energy Laboratory, USA

Kim, Moon J., The University of Texas at Dallas, USA

Mao, Samul S., University of California Berkeley, USA

Potyrailo, Radislav A., General Electric Company, USA

Siffert, Paul M., European Materials Research Society, France

Tsukihashi, Fumitaka, The University of Tokyo, Japan

Wang, Hong, China Building Materials Academy, China

Weber, Eicke R., Fraunhofer Institute for Solar Energy Systems ISE, Germany

Weng, Yuqing, China Iron & Steel Research Institute Group, China

Wu, Ling, China Solid State Lighting Alliance, China

Wu, Yicheng, Technical Institute of Physics and Chemistry, CAS, China

Xu, Huibing, Beihang University, China

Zhang, Xingdong, Sichuang University, China

Zhou, Shaoxiong, China Iron & Steel Research Institute Group, China


Medical Instrumentation

Guest Editors-in-Chief

Wang, Weiqi, Fudan University, China

He, Bin, University of Minnesota, USA


Executive Associate Editors

Xu, Lisa X., Shanghai Jiao Tong University, China

Fowlkes, J. Brian, University of Michigan, USA


Members

Brown, Emery, Massachusetts Institute of Technology, USA

Cheng, Jing, Tsinghua University, China

Gambhir, Sanjiv Sam, Stanford University, USA

Glover, Gary H., Stanford University, USA

Laugier, Pascal, University Pierre and Marie CURIE , France

Lee, Raphael, University of Chicago, USA

O'Donnell, Matthew, University of Washington, USA

Tian, Jie, Chinese Academy of Science, China

Tong, Shanbao, Shanghai Jiao Tong University, China

Wheeler, Bruce, University of Florida, USA

Yang, Guang-Zhong, Imperial College of London, UK


Contents Volume 1 · Issue 3 · 2015. Pages 275-398 16 articles

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Views & Comments

Big Data for Precision Medicine

Daniel Richard Leff, Guang-Zhong Yang

Engineering 2015, Volume 1, Issue 3,   Pages 277-279 doi:10.15302/J-ENG-2015075

Abstract 893 PDF 59

Precision Burn Trauma Medicine: Application for Molecular Engineering Science

Kristen Jakubowski, Michael Poellmann, Raphael C. Lee

Engineering 2015, Volume 1, Issue 3,   Pages 280-281 doi:10.15302/J-ENG-2015073

Abstract 670 PDF 20

Engineering for Human Security and Well-Being

Hideaki Koizumi

Engineering 2015, Volume 1, Issue 3,   Pages 282-287 doi:10.15302/J-ENG-2015066

Abstract 867 PDF 44

Research

Medical Instrumentation

Visual Prostheses: Technological and Socioeconomic Challenges Perspective

John B. Troy

Engineering 2015, Volume 1, Issue 3,   Pages 288-291 doi:10.15302/J-ENG-2015080

Abstract 1133 PDF 33

Systems Neuroengineering: Understanding and Interacting with the Brain Review

Bradley J. Edelman,Nessa Johnson,Abbas Sohrabpour,Shanbao Tong,Nitish Thakor,Bin He

Engineering 2015, Volume 1, Issue 3,   Pages 292-308 doi:10.15302/J-ENG-2015078

Abstract 2803 PDF 135

Optical Molecular Imaging Frontiers in Oncology: The Pursuit of Accuracy and Sensitivity Review

Kun Wang,Chongwei Chi,Zhenhua Hu,Muhan Liu,Hui Hui,Wenting Shang,Dong Peng,Shuang Zhang,Jinzuo Ye,Haixiao Liu,Jie Tian

Engineering 2015, Volume 1, Issue 3,   Pages 309-323 doi:10.15302/J-ENG-2015082

Abstract 2025 PDF 104

Smartphone-Imaged HIV-1 Reverse-Transcription Loop-Mediated Isothermal Amplification (RT-LAMP) on a Chip from Whole Blood Article

Gregory L. Damhorst,Carlos Duarte-Guevara,Weili Chen,Tanmay Ghonge,Brian T. Cunningham,Rashid Bashir

Engineering 2015, Volume 1, Issue 3,   Pages 324-335 doi:10.15302/J-ENG-2015072

Abstract 1634 PDF 90

An Ultrasonic Backscatter Instrument for Cancellous Bone Evaluation in Neonates Article

Chengcheng Liu,Rong Zhang,Ying Li,Feng Xu,Dean Ta,Weiqi Wang

Engineering 2015, Volume 1, Issue 3,   Pages 336-343 doi:10.15302/J-ENG-2015079

Abstract 684 PDF 18

Characterizing Thermal Augmentation of Convection-Enhanced Drug Delivery with the Fiberoptic Microneedle Device Article

R. Lyle Hood,Rudy T. Andriani,Tobias E. Ecker,John L. Robertson,Christopher G. Rylander

Engineering 2015, Volume 1, Issue 3,   Pages 344-350 doi:10.15302/J-ENG-2015077

Abstract 725 PDF 26

A Confocal Endoscope for Cellular Imaging Article

Jiafu Wang,Min Yang,Li Yang,Yun Zhang,Jing Yuan,Qian Liu,Xiaohua Hou,Ling Fu

Engineering 2015, Volume 1, Issue 3,   Pages 351-360 doi:10.15302/J-ENG-2015081

Abstract 3086 PDF 176

Electrical and Electronic Engineering

Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor Article

Guoyou Liu,Rongjun Ding,Haihui Luo

Engineering 2015, Volume 1, Issue 3,   Pages 361-366 doi:10.15302/J-ENG-2015043

Abstract 2731 PDF 132

Materials Genome Engineering

High-Throughput Multi-Plume Pulsed-Laser Deposition for Materials Exploration and Optimization Article

Samuel S. Mao,Xiaojun Zhang

Engineering 2015, Volume 1, Issue 3,   Pages 367-371 doi:10.15302/J-ENG-2015065

Abstract 831 PDF 30

Materials Design on the Origin of Gap States in a High-κ/GaAs Interface Article

Weichao Wang,Cheng Gong,Ka Xiong,Santosh K.C.,Robert M. Wallace,Kyeongjae Cho

Engineering 2015, Volume 1, Issue 3,   Pages 372-377 doi:10.15302/J-ENG-2015052

Abstract 890 PDF 26

Single-Seed Casting Large-Size Monocrystalline Silicon for High-Efficiency and Low-Cost Solar Cells Article

Bing Gao,Satoshi Nakano,Hirofumi Harada,Yoshiji Miyamura,Takashi Sekiguchi,Koichi Kakimoto

Engineering 2015, Volume 1, Issue 3,   Pages 378-383 doi:10.15302/J-ENG-2015032

Abstract 991 PDF 30

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability Article

Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang

Engineering 2015, Volume 1, Issue 3,   Pages 384-390 doi:10.15302/J-ENG-2015034

Abstract 932 PDF 28

Mechanical Engineering

A Precision-Positioning Method for a High-Acceleration Low-Load Mechanism Based on Optimal Spatial and Temporal Distribution of Inertial Energy Article

Xin Chen,Youdun Bai,Zhijun Yang,Jian Gao,Gongfa Chen

Engineering 2015, Volume 1, Issue 3,   Pages 391-398 doi:10.15302/J-ENG-2015063

Abstract 590 PDF 37