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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensorsThis paper presents a review of MEMS-based thermoelectric IR sensors.

Keywords: thermoelectric infrared sensor     CMOS-MEMS     thermopile     micromachining     wafer-level package    

Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 457-458 doi: 10.1007/s11465-017-0492-4

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 490-509 doi: 10.1007/s11465-017-0484-4

Abstract: barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMSachieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMSCompared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encouragewider participation in MEMS research at institutions or for individuals with limited or no access to

Keywords: direct-write     additive manufacturing     microfabrication     MEMS    

Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 526-538 doi: 10.1007/s11465-017-0451-0

Abstract: We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based

Keywords: differential scanning calorimetry     biomolecule     MEMS     thermodynamic    

Erratum to: Folded down-conversion mixer for a 60 GHz receiver architecture in 65-nm CMOS technology

Najam Muhammad AMIN,Zhi-gong WANG,Zhi-qun LI

Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 5, doi: 10.1631/FITEE.14e0087

A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

Frontiers of Mechanical Engineering 2023, Volume 18, Issue 2, doi: 10.1007/s11465-023-0747-1

Abstract: Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10−7)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

Keywords: micro-electro-mechanical system capacitive sensor     bionics     operation instability     mechanical and electrical decoupling     biomedical force measurement    

Analysis and design of transformer-based CMOS ultra-wideband millimeter-wave circuits for wireless applications Review Articles

Yi-ming YU, Kai KANG

Frontiers of Information Technology & Electronic Engineering 2020, Volume 21, Issue 1,   Pages 97-115 doi: 10.1631/FITEE.1900491

Abstract: In this paper, four transformer-based ultra-wideband mm-Wave circuits demonstrated in CMOS technologies

Keywords: CMOS     Millimeter-wave (mm-Wave)     Ultra-wideband     Transformer     Low-noise amplifier     Injection-locked fre-quency    

Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Strategic Study of CAE 2004, Volume 6, Issue 7,   Pages 21-25

Abstract: The significance of MEMS and its basic theory are expounded in this paper.Performances of MEMS devices used in wireless communication are summarized, and then a proposition thatMEMS technology is one of the ultimate resolutions for one-chip wireless communication equipment is

Keywords: microsystem     integration     one-chip     wireless communication system    

combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 6,   Pages 497-510 doi: 10.1631/FITEE.1400349

Abstract: The bias drift of a micro-electro-mechanical systems (MEMS) accelerometer suffers from the 1/ noise

Keywords: Bias drift     Closed-loop MEMS accelerometer     Modulated feedback approach     Temperature compensation    

A 9.8–30.1 GHz CMOS low-noise amplifier with a 3.2-dB noise figure using inductor- and transformer-based

Hongchen Chen, Haoshen Zhu, Liang Wu, Wenquan Che, Quan Xue,hongdoublechen@gmail.com,zhuhs@scut.edu.cn,wuliang@cuhk.edu.cn,eewqche@scut.edu.cn,eeqxue@scut.edu.cn

Frontiers of Information Technology & Electronic Engineering 2021, Volume 22, Issue 4,   Pages 586-598 doi: 10.1631/FITEE.2000510

Abstract: A 9.8–30.1 GHz (LNA) with a 3.2-dB minimum noise figure (NF) is presented. At the architecture level, a topology based on (CG) cascading with a common-source (CS) amplifier is proposed for simultaneous wideband input matching and relatively high gain. At the circuit level, multiple techniques are proposed to improve LNA performance. First, in the CG stage, loading effect is properly used instead of the conventional feedback technique, to enable simultaneous impedance and noise matching. Second, based on in-depth theoretical analysis, the inductor- and -based techniques are employed for the CG and CS stages, respectively, to enhance the gain and reduce power consumption. Third, the floating-body method, which was originally proposed to lower NF in CS amplifiers, is adopted in the CG stage to further reduce NF. Fabricated in a 65-nm technology, the LNA chip occupies an area of only 0.2 mm and measures a maximum power gain of 10.9 dB with −3 dB bandwidth from 9.8 to 30.1 GHz. The NF exhibits a minimum value of 3.2 dB at 15 GHz and is below 5.7 dB across the entire bandwidth. The LNA consumes 15.6 mW from a 1.2-V supply.

Keywords: CMOS;跨导提升技术;低噪声放大器;变压器;共栅级    

Automated optimization technique of CMOS analog cell circuit based on symbolic analysis

Zheng Weishan,Deng Qing,Liu Zhaoxia,Shi Longxing

Strategic Study of CAE 2009, Volume 11, Issue 4,   Pages 50-56

Abstract:

A methodology for automatic design optimization of CMOS analog cell circuits

Keywords: optimization     performance equation     symbolic analysis     genetic algorithm    

Cross-layer efforts for energy-efficient computing: towards peta operations per second perwatt Perspectives

Xiaobo Sharon HU, Michael NIEMIER

Frontiers of Information Technology & Electronic Engineering 2018, Volume 19, Issue 10,   Pages 1209-1223 doi: 10.1631/FITEE.1800466

Abstract: respect to traditional Boolean circuits and von Neumann processors, it will be challenging for beyond-CMOSdevices to compete with the CMOS technology.To take full advantage of beyond-CMOS devices, cross-layer efforts spanning from devices to circuits

Keywords: Moore’s law     Energy-efficient computing     Neural network accelerators     Beyond-CMOS devices    

Development and application of high-end aerospace MEMS

Weizheng YUAN

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 567-573 doi: 10.1007/s11465-017-0424-3

Abstract: paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMSMoreover, several kinds of special MEMS devices with high precision, high reliability, and environmental

Keywords: MEMS     design and manufacture technology     aeronautic and aerospace    

Design and optimization of a gate-controlled dual direction electro-static discharge device for an industry-level fluorescent optical fiber temperature sensor Research Article

Yang WANG, Xiangliang JIN, Jian YANG, Feng YAN, Yujie LIU, Yan PENG, Jun LUO, Jun YANG,jinxl@hunnu.edu.cn,pengyan@shu.edu.cn

Frontiers of Information Technology & Electronic Engineering 2022, Volume 23, Issue 1,   Pages 158-170 doi: 10.1631/FITEE.2000504

Abstract: gate-controlled silicon controlled rectifier (NBL-GCSCR) manufactured by the 0.18 μm standard bipolar- CMOS-DMOS

Keywords: Electric breakdown     Semiconductor device reliability     CMOS technology    

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS

Keywords: Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

Title Author Date Type Operation

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Journal Article

Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

Journal Article

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

Journal Article

Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

Journal Article

Erratum to: Folded down-conversion mixer for a 60 GHz receiver architecture in 65-nm CMOS technology

Najam Muhammad AMIN,Zhi-gong WANG,Zhi-qun LI

Journal Article

A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

Journal Article

Analysis and design of transformer-based CMOS ultra-wideband millimeter-wave circuits for wireless applications

Yi-ming YU, Kai KANG

Journal Article

Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Journal Article

combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

Journal Article

A 9.8–30.1 GHz CMOS low-noise amplifier with a 3.2-dB noise figure using inductor- and transformer-based

Hongchen Chen, Haoshen Zhu, Liang Wu, Wenquan Che, Quan Xue,hongdoublechen@gmail.com,zhuhs@scut.edu.cn,wuliang@cuhk.edu.cn,eewqche@scut.edu.cn,eeqxue@scut.edu.cn

Journal Article

Automated optimization technique of CMOS analog cell circuit based on symbolic analysis

Zheng Weishan,Deng Qing,Liu Zhaoxia,Shi Longxing

Journal Article

Cross-layer efforts for energy-efficient computing: towards peta operations per second perwatt

Xiaobo Sharon HU, Michael NIEMIER

Journal Article

Development and application of high-end aerospace MEMS

Weizheng YUAN

Journal Article

Design and optimization of a gate-controlled dual direction electro-static discharge device for an industry-level fluorescent optical fiber temperature sensor

Yang WANG, Xiangliang JIN, Jian YANG, Feng YAN, Yujie LIU, Yan PENG, Jun LUO, Jun YANG,jinxl@hunnu.edu.cn,pengyan@shu.edu.cn

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article