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Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 457-458 doi: 10.1007/s11465-017-0492-4

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 490-509 doi: 10.1007/s11465-017-0484-4

Abstract: barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMSachieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMSCompared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encouragewider participation in MEMS research at institutions or for individuals with limited or no access to

Keywords: direct-write     additive manufacturing     microfabrication     MEMS    

Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 526-538 doi: 10.1007/s11465-017-0451-0

Abstract: We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based

Keywords: differential scanning calorimetry     biomolecule     MEMS     thermodynamic    

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensorsThis paper presents a review of MEMS-based thermoelectric IR sensors.

Keywords: thermoelectric infrared sensor     CMOS-MEMS     thermopile     micromachining     wafer-level package    

A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

Frontiers of Mechanical Engineering 2023, Volume 18, Issue 2, doi: 10.1007/s11465-023-0747-1

Abstract: Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10−7)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

Keywords: micro-electro-mechanical system capacitive sensor     bionics     operation instability     mechanical and electrical decoupling     biomedical force measurement    

Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Strategic Study of CAE 2004, Volume 6, Issue 7,   Pages 21-25

Abstract: The significance of MEMS and its basic theory are expounded in this paper.Performances of MEMS devices used in wireless communication are summarized, and then a proposition thatMEMS technology is one of the ultimate resolutions for one-chip wireless communication equipment is

Keywords: microsystem     integration     one-chip     wireless communication system    

combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 6,   Pages 497-510 doi: 10.1631/FITEE.1400349

Abstract: The bias drift of a micro-electro-mechanical systems (MEMS) accelerometer suffers from the 1/ noise

Keywords: Bias drift     Closed-loop MEMS accelerometer     Modulated feedback approach     Temperature compensation    

Development and application of high-end aerospace MEMS

Weizheng YUAN

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 567-573 doi: 10.1007/s11465-017-0424-3

Abstract: paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMSMoreover, several kinds of special MEMS devices with high precision, high reliability, and environmental

Keywords: MEMS     design and manufacture technology     aeronautic and aerospace    

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS

Keywords: Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability Article

Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang

Engineering 2015, Volume 1, Issue 3,   Pages 384-390 doi: 10.15302/J-ENG-2015034

Abstract:

Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic (SH) coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.

Keywords: vapor pressure     moisture     semiconductor reliability     microelectromechanical systems (MEMS)     super-hydrophobic    

Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer

Lili CHEN, Wu ZHOU

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2,   Pages 146-149 doi: 10.1007/s11465-013-0260-z

Abstract:

To predict more precisely the frequency of force-balanced micro accelerometer with different bias voltages, the effects of bias voltages on error sensitivity of frequency is studied. The resonance frequency of accelerometer under closed loop control is derived according to its operation principle, and its error sensitivity is derived and analyzed under over etching structure according to the characteristics of Deep Reaction Ion Etching (DRIE). Based on the theoretical results, micro accelerometer is fabricated and tested to study the influences of AC bias voltage and DC bias voltage on sensitivity, respectively. Experimental results indicate that the relative errors between test data and theory data are less than 7%, and the fluctuating value of error sensitivity under the range of voltage adjustment is less than 0.01 μm . It is concluded that the error sensitivity with designed parameters of structure, circuit and process error can be used to predict the frequency of accelerometer with no need to consider the influence of bias voltage.

Keywords: Micro-Electro-Mechanical Systems (MEMS)     micro accelerometer     force-balanced micro accelerometer     frequency    

Wireless passive flexible accelerometer fabricated using micro-electro-mechanical system technology for bending structure surfaces Research Article

Chen LI, Mangu JIA, Yingping HONG, Yanan XUE, Jijun XIONG,lichen@nuc.edu.cn

Frontiers of Information Technology & Electronic Engineering 2022, Volume 23, Issue 5,   Pages 801-809 doi: 10.1631/FITEE.2100236

Abstract: We propose an inductor-capacitor (LC) wireless passive , which eliminates the difficulty in measuring the acceleration on the surface of a bending structure. The accelerometer is composed of a flexible polyimide (PI) substrate and a planar spiral inductance coil (thickness 300 nm), made using . It can be bent or folded at will, and can be attached firmly to the surface of objects with a bending structure. The principle of radio frequency wireless transmission is used to measure the acceleration signal by changing the distance between the accelerometer and the antenna. Compared with other accelerometers with a lead wire, the accelerometer can prevent the lead from falling off in the course of vibration, thereby prolonging its service life. Through establishment of an experimental platform, when the distance between the antenna and accelerometer was 5 mm, the characterization of the surface of bending structures demonstrated the sensing capabilities of the accelerometer at accelerations of 20‒100 m/s. The results indicate that the acceleration and peak-to-peak output voltage were nearly linear, with accelerometer sensitivity reaching 0.27 mV/(m·s). Moreover, the maximum error of the accelerometer was less than 0.037%.

Keywords: Bending structure surfaces     Flexible accelerometer     Micro-electro-mechanical system (MEMS) technology    

Development Trends for China’s Instrumentation Engineering Science and Technology to 2035

Wang Xue and Zhang Li

Strategic Study of CAE 2017, Volume 19, Issue 1,   Pages 103-107 doi: 10.15302/J-SSCAE-2017.01.015

Abstract: main aspects: intelligent instrumentation, medical instruments, and micro-electro-mechanical systems (MEMS

Keywords: instrumentation     intelligent instrumentation     medical instrument     MEMS     trend analysis    

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract:

The packaging of micro electro mechanical systems (MEMS) is referred to first-level packaging andhigh importance not to forget packaging at the beginning of a project, when hoping to industrialize MEMS

Keywords: packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

Title Author Date Type Operation

Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

Journal Article

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

Journal Article

Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

Journal Article

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Journal Article

A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

Journal Article

Research of MEMS and Development of One-chip RF - MEMS

Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang

Journal Article

combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

Journal Article

Development and application of high-end aerospace MEMS

Weizheng YUAN

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability

Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang

Journal Article

Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer

Lili CHEN, Wu ZHOU

Journal Article

Wireless passive flexible accelerometer fabricated using micro-electro-mechanical system technology for bending structure surfaces

Chen LI, Mangu JIA, Yingping HONG, Yanan XUE, Jijun XIONG,lichen@nuc.edu.cn

Journal Article

Peng Chunrong: MEMS Sensor Technology for Power Internet of Things (2020-8-17)

17 Oct 2022

Conference Videos

Development Trends for China’s Instrumentation Engineering Science and Technology to 2035

Wang Xue and Zhang Li

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article