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micro-texture 2

polishing 2

Additive manufacturing 1

CTMP 1

LWST 1

Laser polishing 1

PSV 1

Stitching errors 1

Synchronized control system 1

additive manufacturing 1

aggregates 1

chemical mechanical polishing 1

circular-translational-moving polishing 1

composite abrasives 1

controllable deliquescence 1

copper 1

development tendency 1

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friction skid resistance 1

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Preparation of composite abrasives by electrostatic self assembly methodand its polishing propertiesin Cu chemical mechanical polishing

Huang Yishen,Xu Xuefeng,Yao Chunyan,Hu Jiande and Peng Wei

Strategic Study of CAE 2012, Volume 14, Issue 10, Pages 82-89

Abstract: The composite abrasives slurries are prepared for copper polishing.The polishing results indicate that it is SiO2 abrasives, not only coated SiO2 abrasive on polymer particlesbut also free SiO2 abrasive in slurry, that offer the polishing action.The material removal rates of copper polishing are 264 nm/min, 348 nm/min and 476 nm/min using single

Keywords： chemical mechanical polishing polishing slurry composite abrasives polyelectrolyte copper

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Review on mechanism and process of surface polishing using lasers

Arun KRISHNAN, Fengzhou FANG

Frontiers of Mechanical Engineering 2019, Volume 14, Issue 3, Pages 299-319 doi: 10.1007/s11465-019-0535-0

Abstract: Laser polishing is a technology of smoothening the surface of various materials with highly intense laserHigh precision polishing of surfaces can be done using laser process.Currently, laser polishing has extended its applications from photonics to molds as well as bio-medicalConventional polishing techniques have many drawbacks such as less capability of polishing freeform surfacesparameters briefly to get a better understanding about the entire polishing process.

Keywords： laser polishing surface roughness process parameters mechanism

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Numerical analysis of hydrodynamic process of circular-translational-moving polishing (CTMP)

ZHAI Wenjie, LIU Changxiong, LIANG Yingchun

Frontiers of Mechanical Engineering 2008, Volume 3, Issue 4, Pages 441-448 doi: 10.1007/s11465-008-0074-6

Abstract: By keeping a pad moving relative to a wafer along a circular path without rotation, we developed a polishingtechnique called circular-translational-moving polishing (CTMP), which permits multidirectional polishingof the work piece and thus bears the advantage of isotropic polishing and a potential increase of materialThe reason for negative pressure in CTMP and its effect on polishing is discussed.pitch angles under different working conditions are obtained in terms of the applied load, moments, and polishing

Keywords： numerical analysis practical CTMP circular-translational-moving polishing CTMP different

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Advances in polishing of internal structures on parts made by laser-based powder bed fusion

Frontiers of Mechanical Engineering 2023, Volume 18, Issue 1, doi: 10.1007/s11465-022-0724-0

Abstract: Various polishing technologies for L-PBF components with inner structures are presented, whereas their

Keywords： laser-based powder bed fusion polishing internal structures surface quality surface features post

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Experimental study on high-efficiency polishing for potassium dihydrogen phosphate (KDP) crystal by using

Ziyuan LIU, Hang GAO, Dongming GUO

Frontiers of Mechanical Engineering 2020, Volume 15, Issue 2, Pages 294-302 doi: 10.1007/s11465-019-0576-4

Abstract: , and the effect of relative humidity (RH) on polishing performance is studied.Results show that the polishing performance is improved with increasing RH.However, precisely controlling the RH is extremely difficult during TAWF polishing.and the polishing pad.Excessive polishing pressure and revolution rate remarkably reduce the life of the polishing pad and

Keywords： dihydrogen phosphate (KDP) crystal controllable deliquescence two-phase air–water fluid high-efficiency polishing

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Study on micro-texture and skid resistance of aggregate during polishing

Zhenyu QIAN, Lingjian MENG

Frontiers of Structural and Civil Engineering 2017, Volume 11, Issue 3, Pages 346-352 doi: 10.1007/s11709-017-0409-7

Abstract: The polishing effect on aggregate is simulated by Wehner/Schulze (W/S) device, during the polishing procedureBased on the results of independent T-test and the polishing resistance analysis, it shows that the surface

Keywords： skid resistance of pavement micro-texture aggregates polishing test

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A Laser Scanner–Stage Synchronized System Supporting the Large-Area Precision Polishing of Additive-Manufactured Article

Mengjia Cui, Libin Lu, Zhen Zhang, Yingchun Guan

Engineering 2021, Volume 7, Issue 12, Pages 1732-1740 doi: 10.1016/j.eng.2020.06.028

Abstract: proposes a scanner–stage synchronized approach emphasizing a novel control structure for the laser polishing

Keywords： Laser polishing Stitching errors Synchronized control system Additive manufacturing

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Laboratory and field evaluation of asphalt pavement surface friction resistance

Zhong WU, Chris ABADIE

Frontiers of Structural and Civil Engineering 2018, Volume 12, Issue 3, Pages 372-381 doi: 10.1007/s11709-017-0463-1

Abstract: with different combinations of aggregate sources were evaluated in laboratory using an accelerated polishingin a wearing course mix design would meet field friction requirements under a certain design traffic polishing

Keywords： friction skid resistance polishing PSV LWST micro-texture macro-texture