2018年 第13卷 第2期
《机械工程前沿（英文）》 >> 2018年 第13卷 第2期 doi: 10.1007/s11465-018-0504-z
A review on ductile mode cutting of brittle materials
1. Department of Mechanical Engineering, National University of Singapore, Singapore.
2. Singapore Institute of Manufacturing Technology, Singapore
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摘要
Brittle materials have been widely employed for industrial applications due to their excellent mecha-nical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.
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