Liquid metal cooling in thermal management of computer chips

2007年第1卷第4期

摘要

关键词

相关研究

回顶部

《能源前沿（英文）》 >> 2007年第1卷第4期 doi: 10.1007/s11708-007-0057-3

Liquid metal cooling in thermal management of computer chips

Cryogenic Laboratory, P. O. Box 2711, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100080, China

发布日期： 2007-12-05

HTML19 PDF 3 收藏 0

摘要

With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the he

关键词

tremendous ; computer performance ; generation ; management ; improvement