[ 1 ] 高蕾 , 符永铨 , 李东升 , 等 . 我国人工智能核心软硬件发展战略研究 [J]. 中国工程科学 , 2021 , 23 3 : 90 ‒ 97 .
Gao L, Fu Y Q, Li D S, et al. Development strategy for the core software and hardware of artificial intelligence in China [J]. Strategic Study of CAE, 2021, 23(3): 90‒97. Chinese.

[ 2 ] 黄强 , 孟非 , 余张国 , 等 . 陆空协同多模态智能机器人系统发展战略研究 [J]. 中国工程科学 , 2021 , 23 5 : 116 ‒ 121 .
Huang Q, Meng F, Yu Z G, et al. Development strategy for air ground collaborative multi-modal intelligent robot system [J]. Strategic Study of CAE, 2021, 23(5): 116‒121. Chinese.

[ 3 ] 商惠敏 . 人工智能芯片产业技术发展研究 [J]. 全球科技经济瞭望 , 2021 , 36 12 : 24 ‒ 30 .
Shang H M. Research on technology development of artificial intelligence chip industry [J]. Global Science, Technology and Economy Outlook, 2021, 36(12): 24‒30. Chinese.

[ 4 ] "先进半导体材料及辅助材料"编写组 . 中国先进半导体材料及辅助材料发展战略研究 [J]. 中国工程科学 , 2020 , 22 5 : 10 ‒ 19 .
Writing Group of Advanced Semiconductor Materials and Auxiliary Materials. Strategic study on the development of advanced semiconductor materials and auxiliary materials in China [J]. Strategic Study of CAE, 2020, 22(5): 10‒19. Chinese.

[ 5 ] 中华人民共和国工业和信息化部 . 十五部门关于印发《"十四五"机器人产业发展规划》的通知 [EBOL]. 2021-12-21 [ 2022-03-23 ]. http:www.gov.cnzhengcezhengceku2021-1228content_5664988.htm .
Ministry of Industry and Information Technology of the People’s Republic of China. Notice of fifteen departments for regarding the issuance of the 14th Five-Year Plan for robot industry development plan [EB/OL]. (2021-12-21) [2022-03-23]. Chinese.

[ 6 ] Murray S, Floyd-Jones W, Qi Y, et al. Robot motion planning on a Chip [C]. Ann Arbor: Robotics: Science and Systems, 2016.
Murray S, Floyd-Jones W, Qi Y, et al. Robot motion planning on a Chip [C]. Robotics: Science and Systems, 2016.

[ 7 ] 王耀南 . 人工智能赋能无人系统 [J]. 智能系统学报 , 2021 , 16 1 : 6 .
Wang Y N. Artificial intelligence enhances unmanned systems [J]. CAAI Transactions on Intelligent Systems, 2021, 16(1): 6. Chinese.

[ 8 ] Pei J, Deng L, Song S, et al. Towards artificial general intelligence with hybrid tianjic chip architecture [J]. Nature, 2019, 572(7767): 106‒111.
Pei J, Deng L, Song S, et al. Towards artificial general intelligence with hybrid tianji chip architecture [J]. Nature, 2019, 572(7767): 106‒111.

[ 9 ] Liu Y, Duan X, Shin H J, et al. Promises and prospects of two-dimensional transistors [J]. Nature, 2021, 591(7848): 43‒53.

[10] Mirhoseini A, Goldie A, Yazgan M, et al. A graph placement methodology for fast chip design [J]. Nature, 2021, 594(7862): 207‒212.

[11] 前瞻产业研究院. 2020年中国半导体设备行业市场研究报告 [R]. 深圳: 前瞻产业研究院, 2020.Prospective Industry Research Institute. Market research report of Chinese semiconductor equipment industry in 2020 [R]. Shenzhen: Prospective Industry Research Institute, 2020.
Prospective Industry Research Institute. Market research report of Chinese semiconductor equipment industry in 2020 [R]. Shenzhen: Prospective Industry Research Institute, 2020. Chinese.

[12] 中国电子学会. 2021年中国机器人产业发展报告 [R]. 北京: 中国电子学会, 2021.Chinese Institute of Electronics. Development report of Chinese robot industry in 2021 [R]. Beijing: Chinese Institute of Electronics, 2021.
Chinese Institute of Electronics. Development report of Chinese robot industry in 2021 [R]. Beijing: Chinese Institute of Electronics, 2021. Chinese.

[13] 陶建华 , 陈云霁 . 类脑计算芯片与类脑智能机器人发展现状与思考 [J]. 中国科学院院刊 , 2016 , 31 7 : 803 ‒ 811 .
Tao J H, Chen Y J. Development status and thinking of brain like computing chip and brain like intelligent robot [J]. Bulletin of Chinese Academy of Sciences, 2016, 31(7): 803‒811. Chinese.

[14] Lung H L. AI: From deep learning to in-memory computing [C]. San Jose: Conference on Metrology, Inspection, and Process Control for Microlithography, 2019.

[15] Hung J M, Li X, Wu J, et al. Challenges and trends in developing nonvolatile memory-enabled computing chips for intelligent edge devices [J]. IEEE Transactions on Electron Devices, 2020, 67(4): 1444‒1453.

[16] 林钰登 , 高滨 , 王小虎 , 等 . 基于新型忆阻器的存内计算 [J]. 微纳电子与智能制造 , 2019 , 1 2 : 35 ‒ 46 .
Lin Y D, Gao B, Wang X H, et al. In-memory computing based on novel memristor [J]. Micro/nano Electronics and Intelligent Manufacturing, 2019, 1(2): 35‒46. Chinese.

[17] Yao P, Wu H Q, Gao B, et al. Fully hardware-implemented memristor convolutional neural network [J]. Nature, 2020, 577(7792): 641‒646.

[18] Le Gallo M, Sebastian A, Mathis R, et al. Mixed-precision in-memory computing [J]. Nature Electronics, 2018, 1(4): 246‒253.

[19] Wu P, Su J W, Chung Y L, et al. A 28nm 1Mb time-domain computing-in-memory 6T SRAM macro with 6.6ns latency 1241 GOPS and 37.01 TOPS/W for 8b-MAC operations for Edge-AI devices [C]. Beijing: IEEE International Solid-State Circuits Conference, 2022: 190‒192.
Wu P, Su J W, Chung Y L, et al. A 28nm 1Mb time-domain computing-in-memory 6T SRAM macro with 6.6ns latency 1241 GOPS and 37.01 TOPS/W for 8b-MAC operations for Edge-AI devices [C]. Beijing: IEEE International Solid-State Circuits Conference (ISSCC), 2022: 190‒192.

[20] 国务院办公厅 . 国务院办公厅关于印发新时期促进集成电路产业和软件产业高质量发展若干政策的通知 [EBOL]. 2020-08-04 [ 2022-03-23 ]. http:www.gov.cnzhengcecontent2020-0804content_5532370.htm .
General Office of the State Council. Opinion of General Office of the State Council for promoting the high-quality development of integrated circuit industry and software industry in the new period [EB/OL]. (2020-08-04) [2022-03-23]. Chinese.