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《环境科学与工程前沿(英文)》 >> 2011年 第5卷 第2期 doi: 10.1007/s11783-011-0308-4
Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing
1. School of Environment, Tsinghua University, Beijing 100084, China; 2. Faculty of Science and Technology, University of Macau, Macau 999078, China
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