[ 1 ] DelapierreG .MEMSandmicrosensors, fromlaboratorytocommercialization[A].Proceedingof10thInterna tionaConferenceonSolidStateSensorsandActuators[C], Transsducers’99, Sendai, Japan, PaperNumber1A2, 1999

[ 2 ] SenturiaST , SmithRL .Microsensorpackagingandsystempartitioning[J].SensorsandActuators, 1988, 15:221～234

[ 3 ] TabatO , ShimaokaK , AsashiR , etal.Micromachinedsensorsusing polysiliconsacrificialetchingtechnology[J].SensorsMaterials, 1996, (8) :57～67

[ 4 ] GielesACM , SomersGHJ .Miniaturepressuretrans ducerwithsilicondiaphragm[J].PhilipsTechRev1973, 33:14;TufteON , ChapmanPW , LongD .Silicondiffusedelementpiezoresistivediaphragms[J].JApplPhys, 1962, 33:322;ClarkSK , WiseKD .Pressuresensitivityinanisotropicallyetchedthin di aphragmpressuresensors[J].IEEETransElectronDe vices, 1979, ED 26:1887

[ 5 ] KoWH , SumintoJT , YehGJ.Micromachiningandmicropackagingoftransducers[M ].ElesevierSciencePublishers, 1985

[ 6 ] WallsG , PomerantzD .Fieldassistedglass metalseal ing[J].JApplPhys, 1969, 40:3946～3949

[ 7 ] 黄庆安.硅微机械加工技术[M ].北京:科学出版社, 1996.207～228 链接1

[ 8 ] EsashiM , SugiyamaS , IkedaK , etal.Vacuum sealedsiliconmicromachinedpressuresensors[J].ProcIEEE , 1998, 86:1627～1639

[ 9 ] KobayashiS , HaraT , OguchiT , etal.Double framesilicongyroscopepackagedunderlowpressurebywaferbonding[A].Proceedingof10thInternationalConfer enceonSolidStateSensorsandActuators[C], Trans ducers’99, Sendai, Japan, PaperNumber3D1.3, 1999

[10] LaskyJB .Silicon insulatorbybondingandetchback[A].Proc.IEDM [C], Washington, USA , 1985.684～687;ShimboM , KurukawaF , FukudaF , etal.Silicontosilicondirectbondingmethod[J].JApplPhys, 1986, 60:2987

[11] JiaoJW , LuDR , XiongB , etal.LowtemperatureSDBandinterfacebehavior[J], SensorsandActuators, 1995, A50:117～120;焦继伟, 陆德仁, 王渭源.低温SDB技术研究及表面吸附态的影响[J].半导体学报, 1994, 15:795～798 链接1

[12] PetersenK , BarthP , PoydockJ.Siliconfusionbondingforpressuresensors[A].Rec.IEEESolidStateSen sorsandActuatorsWorkshop[C], 1988:144～147;BarthP .Siliconfusionbondingforfabricationofsen sors, actuatorsandmicrostructures[J].SensorsandActuators, 1990, A2123:919

[13] QuenzerHJ, SchulzAV , KinkopfT , etal.Anodicbondingonglasslayerpreparedbyaspin onglasspro cess[A].Proceedingof11thInternationalConferenceonSolid stateSensorsandActuators[C], Transducers01, Munich, Germany, 2001:230～233

[14] WeichelS , deReusR , BouaidatS , etal.Lowtemper atureanodicbondingtosiliconnitride[A].Proceedingof10thInternationalConferenceonSolid stateSensorsandActuators[C], Transsducers’99, Sendai, Japan, PaperNumber3P1.16, 1999

[15] NeseM , HanneborgA .Anodicbondingofsilicontosil iconwaferscoatedwithaluminum, siliconoxide, polysiliconorsiliconnitride[J].SensorsandActuators, 1993, A 3738:61～67

[16] ChiaoM , LinLW .Acceleratedhermeticitytestingofglass siliconpackageformedbyaluminum to siliconni tridebonding[A].Proceedingof11thInternationalConferenceonSolidStateSensorsandActuators[C], Transducers’01, Munich, Germany.2001:182～185

[17] BertholdA , NicolaL , SarroPM , etal.Anoveltech nologicalprocessforglass to glassanodicbonding[A].Proceedingof10thInternationalConferenceonSolid stateSensorsandActuators[C], Transsducers99, Sendai, JapanPaperNumber4A4.41999

[18] HoweRT .Surfacemicromachiningformicrosensorsandmicroactuators[J].JVacSciTechnol, 1988, B 6:1809～1813

[19] KuennelW , ShermanS .Asurfacemicromachinedsili conaccelerometerwithon chipdetectioncircuitry[J].SensorsandActuators, 1994, A 45:7～16

[20] SampellJB .Thedigitalmicromirrordevicesanditsap plicationtoprojectiondisplays[A].Proceedingof8thInternationalConferenceonSolid stateSensorsandAc tuators[C], Transducers’93, Yokohama, Japan.1993:24～29;DouglassMR .WhyistheTexasIn strumentsdigitalmicromirrordevices (DMD) soreliable[DB/OL].http://www.ti.com/dlp.

[21] AignerR , OppermannKG , KapelsH , etal.Cavity micromachiningtechnology:Azero packagesolutionforinertialsensors[A].Proceedingof11thInternationalConferenceonSolid stateSensorsandActuators[C], Transducers01, Munich, Germany, 2001.186～189

[22] HeGH , LinLW , ChengYT .LocalizedCVDbond ingforMEMSpackaging[A].Proceedingof10thIn ternationalConferenceonSolid stateSensorsandActua tors[C], Transducers’99, Sendai, Japan, PaperNumber4A4.1, 1999

[23] ChangChienPP , WiseKD .Wafer levelpackagingusinglocalizedmassdeposition[A].Proceedingof11thInternationalConferenceonSolid stateSensorsandAc tuators[C], Transducers’01, Munich, Germany, 2001.182～185

[24] 王渭源.影响微电子机械系统成品率和可靠性的粘合力和摩擦力[J].中国工程科学, 2000, 2 (3) :36～41 链接1

[25] LiG , SchmeisingJ , McNeilA , etal.Selectiveencap sulationusingapolymetricorbondedsiliconconstraintdamformediacompatiblepressuresensorapplications[A].Proceedingof11thInternationalConferenceonSolid stateSensorsandActuators[C], Transducers01, Munich, Germany, 2001.178～181

[26] KrassowH , CampabadalF , TamayoEL .Waferlevelpackagingofsiliconpressuresensors[A].Proceedingof10thInternationalConferenceonSolid stateSensorsandActuators[C], Transsducers99, Sendai, Japan, PaperNumber3P1.9, 1999

[27] ReynoldsJK , CatlingDC , BlueRC , etal.Packagingandcalibrationofapiezoresistivepressuresensorforhighaccuracyatlowtemperaturesandpressures[A].Pro ceedingof10thInternationalConferenceonSolid stateSensorsandActuators[C], Transducers99, Sendai, Japan, PaperNumber3P1.22, 1999