Search | Engineering

订阅投稿

首页工程期刊工程焦点工程成就工程前沿关于我们 English

资源类型

期刊论文 18

会议视频 1

年份

2023 2

2022 2

2018 1

2017 7

2015 2

2013 1

2007 1

2006 1

2004 1

2002 1

展开︾

关键词

微机电系统 3

仪器仪表 1

仿生智能技术 1

体硅键合技术 1

信息技术 1

力矩反馈器 1

医疗仪器 1

半导体可靠性 1

单芯片 1

场效应管 1

弯曲结构表面；柔性加速度计；微机电系统（MEMS）技术；无线非接触式测量 1

微力传感器 1

微机电系统(MEMS) 1

微电子机械系统封装技术 1

微系统 1

无线通信系统 1

无轴轮缘推进技术 1

智能仪器仪表 1

智能无人飞行器技术 1

展开︾

检索范围：

排序：展示方式：

Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

《机械工程前沿（英文）》 2017年第12卷第4期页码 457-458 doi: 10.1007/s11465-017-0492-4

HTML PDF 收藏

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

《机械工程前沿（英文）》 2017年第12卷第4期页码 490-509 doi: 10.1007/s11465-017-0484-4

摘要：

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the . The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

关键词： direct-write additive manufacturing microfabrication MEMS

HTML PDF 收藏

Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

《机械工程前沿（英文）》 2017年第12卷第4期页码 526-538 doi: 10.1007/s11465-017-0451-0

摘要：

Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.

关键词： differential scanning calorimetry biomolecule MEMS thermodynamic

HTML PDF 收藏

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

《机械工程前沿（英文）》 2017年第12卷第4期页码 557-566 doi: 10.1007/s11465-017-0441-2

摘要：

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

关键词： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

HTML PDF 收藏

A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

《机械工程前沿（英文）》 2023年第18卷第2期 doi: 10.1007/s11465-023-0747-1

摘要： Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10⁻⁷)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

关键词： micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement

HTML PDF 收藏

微系统研究的思考和单芯片RF-MEMS研究进展

钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良

《中国工程科学》 2004年第6卷第7期页码 21-25

摘要：文章阐述了微系统研究的意义以及微系统基础研究的重要性，概述了用于无线通信设备的MEMS器件的性能，指出了MEMS技术是最终实现单芯片机电一体化无线收发系统的根本途径之一，介绍了用于无线通信网络的单芯片机电一体化的微系统研究进展情况

关键词：微系统集成单芯片无线通信系统

HTML PDF 收藏

combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

《信息与电子工程前沿（英文）》 2015年第16卷第6期页码 497-510 doi: 10.1631/FITEE.1400349

摘要： The bias drift of a micro-electro-mechanical systems (MEMS) accelerometer suffers from the 1/ noise and the temperature effect. For massive applications, the bias drift urgently needs to be improved. Conventional methods often cannot address the 1/ noise and temperature effect in one architecture. In this paper, a combined approach on closed-loop architecture modification is proposed to minimize the bias drift. The modulated feedback approach is used to isolate the 1/ noise that exists in the conventional direct feedback approach. Then a common mode signal is created and added into the closed loop on the basis of modulated feedback architecture, to compensate for the temperature drift. With the combined approach, the bias instability is improved to less than 13 μ , and the drift of the Allan variance result is reduced to 17 μ at 100 s of the integration time. The temperature coefficient is reduced from 4.68 to 0.1 m /°C. The combined approach could be useful for many other closed-loop accelerometers.

关键词： Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation

HTML PDF 收藏

Development and application of high-end aerospace MEMS

Weizheng YUAN

《机械工程前沿（英文）》 2017年第12卷第4期页码 567-573 doi: 10.1007/s11465-017-0424-3

摘要：

This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.

关键词： MEMS design and manufacture technology aeronautic and aerospace

HTML PDF 收藏

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

《机械工程前沿（英文）》 2006年第1卷第2期页码 238-241 doi: 10.1007/s11465-006-0011-5

摘要： Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, and bonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors. The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, and then Si-Au alloy bonding was formed by annealing at 400vH for 2 h. The air sealability of the cavity after bonding was finally tested using the N filling method. The results indicate that large bond strength was obtained at the bonding interface. This process was used in fabricating a pressure sensor with a sandwich structure. The results indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging.

关键词： Si/Au-glass strength MEMS packaging process sandwich structure

HTML PDF 收藏

蒸汽压力和超疏水纳米复合涂层对微电子器件可靠性的影响 Article

樊学军,陈良彪,汪正平,Hsing-Wei Chu,张国旗

《工程（英文）》 2015年第1卷第3期页码 384-390 doi: 10.15302/J-ENG-2015034

摘要：

由于高蒸汽压力可能导致微电子器件在高温和高湿度环境中失效，蒸汽压力的描述和模拟对研究微电子器件的湿度可靠性至关重要。为了最大程度地减小湿度的影响，可以在器件外表面涂抹一层超疏水涂层，以防止水分渗入。但是，超疏水涂层提高微电子器件可靠性的具体机制目前仍没有完全被理解。本文首先介绍了微电子高分子材料蒸汽压力的现有的一些理论。笔者还根据实验结果论述了超疏水涂层在防止水蒸气进入器件方面的机制和有效性。本文重点讨论了两个理论模型：基于微观力学的全场蒸汽压力模型和对流扩散模型。这两种方法都已成功用于说明无涂层样本的实验结果。但是，当器件上涂有超疏水纳米复合涂层时，笔者仍发现器件质量增加，其原因很可能是水蒸气可以透过超疏水涂层渗入。这种现象导致人们对超疏水涂层的有效性产生怀疑。根据理论和实验结果，笔者认为需要提出一种新的理论来理解水蒸气如何渗透超疏水涂层。

关键词：蒸汽压力湿度半导体可靠性微机电系统(MEMS) 超疏水纳米复合涂层

HTML PDF 收藏

Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer

Lili CHEN, Wu ZHOU

《机械工程前沿（英文）》 2013年第8卷第2期页码 146-149 doi: 10.1007/s11465-013-0260-z

摘要：

To predict more precisely the frequency of force-balanced micro accelerometer with different bias voltages, the effects of bias voltages on error sensitivity of frequency is studied. The resonance frequency of accelerometer under closed loop control is derived according to its operation principle, and its error sensitivity is derived and analyzed under over etching structure according to the characteristics of Deep Reaction Ion Etching (DRIE). Based on the theoretical results, micro accelerometer is fabricated and tested to study the influences of AC bias voltage and DC bias voltage on sensitivity, respectively. Experimental results indicate that the relative errors between test data and theory data are less than 7%, and the fluctuating value of error sensitivity under the range of voltage adjustment is less than 0.01 μm . It is concluded that the error sensitivity with designed parameters of structure, circuit and process error can be used to predict the frequency of accelerometer with no need to consider the influence of bias voltage.

关键词： Micro-Electro-Mechanical Systems (MEMS) micro accelerometer force-balanced micro accelerometer frequency error sensitivity