资源类型

期刊论文 53

会议信息 2

会议视频 2

年份

2022 13

2021 5

2020 3

2019 2

2018 2

2017 5

2016 4

2015 6

2014 3

2013 2

2012 1

2011 1

2009 2

2008 1

2007 3

2006 1

2004 2

展开 ︾

关键词

人工智能 2

信息技术 2

健康医疗 2

内容理解 2

2021全球工程前沿 1

AAC 1

CCSS (CoCentric system studio) 1

HuMiX 1

MCF-7细胞球 1

SNP基因分型芯片 1

SNP芯片 1

SoC 1

System C 1

μ-TAS 1

产业组织 1

产业链 1

人工智能芯片 1

人类免疫缺陷病毒(HIV) 1

企业案例 1

展开 ︾

检索范围:

排序: 展示方式:

Genome-wide association study of the backfat thickness trait in two pig populations

Dandan ZHU,Xiaolei LIU,Rothschild MAX,Zhiwu ZHANG,Shuhong ZHAO,Bin FAN

《农业科学与工程前沿(英文)》 2014年 第1卷 第2期   页码 91-95 doi: 10.15302/J-FASE-2014005

摘要: Backfat thickness is a good predictor of carcass lean content, an economically important trait, and a main breeding target in pig improvement. In this study, the candidate genes and genomic regions associated with the tenth rib backfat thickness trait were identified in two independent pig populations, using a genome-wide association study of porcine 60K SNP genotype data applying the compressed mixed linear model (CMLM) statistical method. For each population, 30 most significant single-nucleotide polymorphisms (SNPs) were selected and SNP annotation implemented using Build 10.2. In the first population, 25 significant SNPs were distributed on seven chromosomes, and SNPs on SSC1 and SSC7 showed great significance for fat deposition. The most significant SNP (ALGA0006623) was located on SSC1, upstream of the gene. In the second population, 27 significant SNPs were recognized by annotation, and 12 SNPs on SSC12 were related to fat deposition. Two haplotype blocks, M1GA0016251-MARC0075799 and ALGA0065251-MARC0014203-M1GA0016298-ALGA0065308, were detected in significant regions where the and genes were identified as contributing to fat metabolism. The results indicated that genetic mechanism regulating backfat thickness is complex, and that genome-wide associations can be affected by populations with different genetic backgrounds.

关键词: backfat thickness     SNP chip     genome-wide association study     compressed mixed linear model     pig    

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

《机械工程前沿(英文)》 2012年 第7卷 第1期   页码 29-37 doi: 10.1007/s11465-012-0314-7

摘要:

Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

关键词: flip chip     defect detection     ultrasonic excitation     vibration analysis    

BASED ON CHLOROPLAST SNP, NUCLEAR SSR AND WHOLE-GENOME SEQUENCING

《农业科学与工程前沿(英文)》 2022年 第9卷 第4期   页码 627-641 doi: 10.15302/J-FASE-2021436

摘要:

Fortunella genus consists of two populations: cultivated kumquat and wild Hong Kong kumquat.

关键词: Citrus     Fortunella     kumquat     phylogenetics    

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿(英文)》 2009年 第4卷 第4期   页码 472-472 doi: 10.1007/s11465-009-0077-y

牙鲆50K SNP芯片的研制及其在抗病性状基因组选择中的应用 Article

周茜, 陈亚东, 卢昇, 刘洋, 徐文腾, 李仰真, 王磊, 王娜, 杨英明, 陈松林

《工程(英文)》 2021年 第7卷 第3期   页码 406-411 doi: 10.1016/j.eng.2020.06.017

摘要: 在本文中,我们研发了一款牙鲆50K“鱼芯1号”SNP芯片,并将其应用于抗病基因组选择。利用Affymetrix Axiom基因分型技术,我们从1099个个体的全基因组重测序数据中获得了超过4220万个SNP,从中选择了在基因组中均匀分布的48 697个SNP,研制成“鱼芯1号”SNP芯片。利用168个牙鲆个体对“鱼芯1号”芯片的分型效果进行了评价,结果表明,检出率(call rate, CR)高于98%的SNP位点占74.7%,多态性SNP位点具有较好的等位基因分离效果,并且85%以上的SNP与基于全基因组重测序数据获得的SNP一致。

关键词: 牙鲆     单核苷酸多态性     SNP芯片     抗病性     基因组选择    

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

《机械工程前沿(英文)》 2013年 第8卷 第2期   页码 118-126 doi: 10.1007/s11465-013-0253-y

摘要:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.

关键词: LED chip sorter     multi-domain modeling and simulation     parameter optimization     modelica language    

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

《机械工程前沿(英文)》 2017年 第12卷 第4期   页码 581-590 doi: 10.1007/s11465-017-0454-x

摘要:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

关键词: electric field microsensor     three-dimensional     single-chip     in-plane rotation    

原子界面催化合成SnP/CoP异质纳米晶嵌入碳杂化物用于高功率型锂离子电池 Article

胡晨, 胡彦杰, 陈爱平, 段学志, 江浩, 李春忠

《工程(英文)》 2022年 第18卷 第11期   页码 154-160 doi: 10.1016/j.eng.2021.11.026

摘要:

磷化锡(SnP)具有极佳的锂离子扩散能力和高理论比容量,是高功率锂离子电池的理想负极材料。然而,SnP的合成难度高,大尺寸晶粒导致的电化学不可逆也阻碍了其应用。根据密度泛函理论(DFT)计算,使用原位催化磷化方法可以显著降低SnP的相对生成能。因此,在还原氧化石墨烯(rGO)包裹的碳骨架内合成了SnP/CoP异质纳米晶。充放电机理分析表明尺寸为4.0 nm的SnP/CoP纳米晶具有高反应可逆性,且CoP在较高电位生成的金属Co加速了低电位SnP反应的动力学,从而赋予材料超快充放电能力。

关键词: 催化磷化     磷化锡     异质纳米晶     快速充电     锂离子电池    

3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

《机械工程前沿(英文)》 2017年 第12卷 第2期   页码 203-214 doi: 10.1007/s11465-017-0421-6

摘要:

Predictive models for machining operations have been significantly improved through numerous methods in recent decades. This study proposed a 3D finite element modeling (3D FEM) approach for the micro end-milling of Al6061-T6. Finite element (FE) simulations were performed under different cutting conditions to obtain realistic numerical predictions of chip flow, burr formation, and cutting forces. FE modeling displayed notable advantages, such as capability to easily handle any type of tool geometry and any side effect on chip formation, including thermal aspect and material property changes. The proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip. The prediction capability of the FE model was validated by comparing numerical model and experimental test results. Burr dimension trends were correlated with force profile shapes. However, the FE predictions overestimated the real force magnitude. This overestimation indicates that the model requires further development.

关键词: 3D finite element modeling     micro end-milling     cutting force     chip formation     burr formation    

用于器官芯片的工程化血管系统 Review

Abdellah Aazmi, 周竑钊, 李雨亭, 俞梦飞, 许晓斌, 吴钰桐, 马梁, 张斌, 杨华勇

《工程(英文)》 2022年 第9卷 第2期   页码 131-147 doi: 10.1016/j.eng.2021.06.020

摘要:

器官芯片技术是一种很有前途的三维(3D)动态培养方法,可确保准确高效的细胞培养,在临床前试验中具有替代动物模型的巨大潜力。血管系统是人体内最丰富的器官,在氧气交换和物质传递中起着至关重要的作用,是组织器官生存的决定性因素。因此,必须将血管系统集成到器官芯片中,以重建组织和器官微环境及其生理功能。本文讨论了血管与新兴器官芯片技术之间的协同作用,为复现生理学和疾病特征提供了更好的可能性。此外,回顾了血管化的器官芯片制造过程的不同步骤,包括使用不同生物制造策略的结构制造和组织构建。最后,概述了这项技术在器官和肿瘤培养这个有极具吸引力且快速发展的领域的适用性。

关键词: 器官芯片     血管     生物打印     肿瘤芯片    

三维芯片成像

Marcus Woo

《工程(英文)》 2020年 第6卷 第5期   页码 485-486 doi: 10.1016/j.eng.2020.03.009

Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿(英文)》 2009年 第4卷 第4期   页码 393-396 doi: 10.1007/s11465-009-0043-8

摘要: This paper presents the development of an integrated sensor using two types of smart materials: electrorheological (ER) fluids and conducting polymers (CPs). The developed ER chip worked as an actuator, and it was driven by different voltages and control frequencies. When the four electrodes are controlled synchronously, the diaphragm acts as a vibrator whose frequency can be adjusted in accordance with the frequency of the electrical signals. The response signals of the CP sensor were recorded, and its properties were analyzed. Experimental results show that the amplitude decreases monotonically when the frequency increases, owing to the time delay in the pressure buildup in the ER chip. However, the displacement fluctuation of the diaphragm below 20Hz can be detected clearly even if the value is very low. When the vibration frequency is larger than 20Hz, the CP sensor can hardly detect the displacement fluctuation. Thus, the upper limit frequency that the CP sensor can detect is about 20Hz. The practical applications of this microdevice are also discussed.

关键词: electrorheological (ER) fluids     conducting polymer (CP)     polydimethylsioxane (PDMS)     driving frequency     amplitude     bubble counter    

分析芯片微通道制作技术进展

魏守水,张玉林,崔大付

《中国工程科学》 2004年 第6卷 第10期   页码 90-94

摘要:

微通道制作是微分析芯片制作中的关键技术之一。就选取材料的原则,模板复制中的模具制造技术及微通道直接加工方法做了比较,提出了微流体芯片产业化的可行性方案。

关键词: 分析芯片     微细加工     μ-TAS    

机器学习推动人类芯片设计

Robert Pollie

《工程(英文)》 2022年 第10卷 第3期   页码 7-9 doi: 10.1016/j.eng.2022.01.006

Biological chip technology to quickly batch select optimum cryopreservation procedure

YU Lina, LIU Jing, ZHOU Yixin, HUA Zezhao

《能源前沿(英文)》 2007年 第1卷 第3期   页码 316-321 doi: 10.1007/s11708-007-0046-2

摘要: In the practices of cryobiology, selection of an optimum freeze/thawing program and an idealistic cryoprotective agent often requires rather tedious, time consuming and repetitive tests. Integrating the functions of sample preparation and viability detection, the concept of biochip technology was introduced to the field of cryopreservation, aiming at quickly finding an optimum freezing and thawing program. Prototype devices were fabricated and corresponding experimental tests were performed. It was shown that microflow-channel chip could not offer a high quality solution distribution. As an alternative, the spot-dropping chip proved to be an excellent way to load the sample quickly and reliably. Infrared thermal mapping on such a chip showed that it had a rather uniform heat transfer boundary. Applying the spot-dropping chip combined with the thermoelectric cooling device, the final output of cryopreservation of multiple samples was tested, and the optimal freeze/thawing program as well as the potentially best concentration of the cryoprotective agent was found by analyzing the results. Further, application of this technique to measure the thermo-physical properties of the cryo-protective agent was also investigated. The study demonstrated that a biochip with integrated automatic loading and inspection units opens the possibility of a massive optimization of the complex cryopreservation program in a quicker and more economical way.

关键词: idealistic cryoprotective     concentration     Prototype     technology     alternative    

标题 作者 时间 类型 操作

Genome-wide association study of the backfat thickness trait in two pig populations

Dandan ZHU,Xiaolei LIU,Rothschild MAX,Zhiwu ZHANG,Shuhong ZHAO,Bin FAN

期刊论文

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

期刊论文

BASED ON CHLOROPLAST SNP, NUCLEAR SSR AND WHOLE-GENOME SEQUENCING

期刊论文

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

期刊论文

牙鲆50K SNP芯片的研制及其在抗病性状基因组选择中的应用

周茜, 陈亚东, 卢昇, 刘洋, 徐文腾, 李仰真, 王磊, 王娜, 杨英明, 陈松林

期刊论文

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

期刊论文

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

期刊论文

原子界面催化合成SnP/CoP异质纳米晶嵌入碳杂化物用于高功率型锂离子电池

胡晨, 胡彦杰, 陈爱平, 段学志, 江浩, 李春忠

期刊论文

3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

期刊论文

用于器官芯片的工程化血管系统

Abdellah Aazmi, 周竑钊, 李雨亭, 俞梦飞, 许晓斌, 吴钰桐, 马梁, 张斌, 杨华勇

期刊论文

三维芯片成像

Marcus Woo

期刊论文

Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

期刊论文

分析芯片微通道制作技术进展

魏守水,张玉林,崔大付

期刊论文

机器学习推动人类芯片设计

Robert Pollie

期刊论文

Biological chip technology to quickly batch select optimum cryopreservation procedure

YU Lina, LIU Jing, ZHOU Yixin, HUA Zezhao

期刊论文