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Genome-wide association study of the backfat thickness trait in two pig populations
Dandan ZHU,Xiaolei LIU,Rothschild MAX,Zhiwu ZHANG,Shuhong ZHAO,Bin FAN
《农业科学与工程前沿(英文)》 2014年 第1卷 第2期 页码 91-95 doi: 10.15302/J-FASE-2014005
关键词: backfat thickness SNP chip genome-wide association study compressed mixed linear model pig
Detection of solder bump defects on a flip chip using vibration analysis
Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO
《机械工程前沿(英文)》 2012年 第7卷 第1期 页码 29-37 doi: 10.1007/s11465-012-0314-7
Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.
关键词: flip chip defect detection ultrasonic excitation vibration analysis
牙鲆50K SNP芯片的研制及其在抗病性状基因组选择中的应用 Article
周茜, 陈亚东, 卢昇, 刘洋, 徐文腾, 李仰真, 王磊, 王娜, 杨英明, 陈松林
《工程(英文)》 2021年 第7卷 第3期 页码 406-411 doi: 10.1016/j.eng.2020.06.017
Jie OUYANG, Bin LI, Shihua GONG
《机械工程前沿(英文)》 2013年 第8卷 第2期 页码 118-126 doi: 10.1007/s11465-013-0253-y
To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.
关键词: LED chip sorter multi-domain modeling and simulation parameter optimization modelica language
Single-chip 3D electric field microsensor
Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 581-590 doi: 10.1007/s11465-017-0454-x
This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.
关键词: electric field microsensor three-dimensional single-chip in-plane rotation
Development of an electrorheological chip and conducting polymer based sensor
Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,
《机械工程前沿(英文)》 2009年 第4卷 第4期 页码 472-472 doi: 10.1007/s11465-009-0077-y
SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS
《农业科学与工程前沿(英文)》 2023年 第10卷 第3期 页码 448-457 doi: 10.15302/J-FASE-2023490
● Low-value biowaste including wood chip and potato peel was valorized to syngas.
关键词: Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip
原子界面催化合成SnP/CoP异质纳米晶嵌入碳杂化物用于高功率型锂离子电池 Article
胡晨, 胡彦杰, 陈爱平, 段学志, 江浩, 李春忠
《工程(英文)》 2022年 第18卷 第11期 页码 154-160 doi: 10.1016/j.eng.2021.11.026
磷化锡(SnP)具有极佳的锂离子扩散能力和高理论比容量,是高功率锂离子电池的理想负极材料。然而,SnP的合成难度高,大尺寸晶粒导致的电化学不可逆也阻碍了其应用。根据密度泛函理论(DFT)计算,使用原位催化磷化方法可以显著降低SnP的相对生成能。因此,在还原氧化石墨烯(rGO)包裹的碳骨架内合成了SnP/CoP异质纳米晶。充放电机理分析表明尺寸为4.0 nm的SnP/CoP纳米晶具有高反应可逆性,且CoP在较高电位生成的金属Co加速了低电位SnP反应的动力学,从而赋予材料超快充放电能力。
A. DAVOUDINEJAD, P. PARENTI, M. ANNONI
《机械工程前沿(英文)》 2017年 第12卷 第2期 页码 203-214 doi: 10.1007/s11465-017-0421-6
Predictive models for machining operations have been significantly improved through numerous methods in recent decades. This study proposed a 3D finite element modeling (3D FEM) approach for the micro end-milling of Al6061-T6. Finite element (FE) simulations were performed under different cutting conditions to obtain realistic numerical predictions of chip flow, burr formation, and cutting forces. FE modeling displayed notable advantages, such as capability to easily handle any type of tool geometry and any side effect on chip formation, including thermal aspect and material property changes. The proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip. The prediction capability of the FE model was validated by comparing numerical model and experimental test results. Burr dimension trends were correlated with force profile shapes. However, the FE predictions overestimated the real force magnitude. This overestimation indicates that the model requires further development.
关键词: 3D finite element modeling micro end-milling cutting force chip formation burr formation
用于器官芯片的工程化血管系统 Review
Abdellah Aazmi, 周竑钊, 李雨亭, 俞梦飞, 许晓斌, 吴钰桐, 马梁, 张斌, 杨华勇
《工程(英文)》 2022年 第9卷 第2期 页码 131-147 doi: 10.1016/j.eng.2021.06.020
器官芯片技术是一种很有前途的三维(3D)动态培养方法,可确保准确高效的细胞培养,在临床前试验中具有替代动物模型的巨大潜力。血管系统是人体内最丰富的器官,在氧气交换和物质传递中起着至关重要的作用,是组织器官生存的决定性因素。因此,必须将血管系统集成到器官芯片中,以重建组织和器官微环境及其生理功能。本文讨论了血管与新兴器官芯片技术之间的协同作用,为复现生理学和疾病特征提供了更好的可能性。此外,回顾了血管化的器官芯片制造过程的不同步骤,包括使用不同生物制造策略的结构制造和组织构建。最后,概述了这项技术在器官和肿瘤培养这个有极具吸引力且快速发展的领域的适用性。
Development of electrorheological chip and conducting polymer-based sensor
Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,
《机械工程前沿(英文)》 2009年 第4卷 第4期 页码 393-396 doi: 10.1007/s11465-009-0043-8
关键词: electrorheological (ER) fluids conducting polymer (CP) polydimethylsioxane (PDMS) driving frequency amplitude bubble counter
魏守水,张玉林,崔大付
《中国工程科学》 2004年 第6卷 第10期 页码 90-94
微通道制作是微分析芯片制作中的关键技术之一。就选取材料的原则,模板复制中的模具制造技术及微通道直接加工方法做了比较,提出了微流体芯片产业化的可行性方案。
Detection of genomic signatures for pig hairlessness using high-density SNP data
Ying SU,Yi LONG,Xinjun LIAO,Huashui AI,Zhiyan ZHANG,Bin YANG,Shijun XIAO,Jianhong TANG,Wenshui XIN,Lusheng HUANG,Jun REN,Nengshui DING
《农业科学与工程前沿(英文)》 2014年 第1卷 第4期 页码 307-313 doi: 10.15302/J-FASE-2014039
标题 作者 时间 类型 操作
Genome-wide association study of the backfat thickness trait in two pig populations
Dandan ZHU,Xiaolei LIU,Rothschild MAX,Zhiwu ZHANG,Shuhong ZHAO,Bin FAN
期刊论文
Detection of solder bump defects on a flip chip using vibration analysis
Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO
期刊论文
Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter
Jie OUYANG, Bin LI, Shihua GONG
期刊论文
Single-chip 3D electric field microsensor
Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA
期刊论文
Development of an electrorheological chip and conducting polymer based sensor
Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,
期刊论文
3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of
A. DAVOUDINEJAD, P. PARENTI, M. ANNONI
期刊论文
Development of electrorheological chip and conducting polymer-based sensor
Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,
期刊论文