Frontiers of Chemical Science and Engineering >> 2007, Volume 1, Issue 4 doi: 10.1007/s11705-007-0060-2
Preparation and rheological behaviors of PA6/SiO2 nanocompiste
1.College of Packaging and Printing, Hunan University of Technology, Zhuzhou 412008, China; 2.The Institute of Polymer Science, Xiangtan University, Xiangtan 411105, China; 3.College of Civil Engineering and Mechanics, Xiangtan University, Xiangtan 411105, China;
Available online:2007-12-05Next Previous
Abstract
Keywords
polyamide ; temperature ; rheological ; activation ; pesudoplastic