[ 1 ] Abidi AA. RF CMOS come of age. IEEE Microw Mag 2003;4(4):47–60. link1

[ 2 ] Dunworth JD, Homayoun A, Ku BH, Ou YC, Chakraborty K, Liu G, et al. A 28GHz BULK-CMOS dual-polarization phased-array transceiver with 24 channels for 5G user and basestation equipment. In: Proceedings of 2018 IEEE International Solid-State Circuits Conference; 2018 Feb 11–15; San Francisco, CA, USA; 2018. p. 70–2.

[ 3 ] Zhang YP. Antenna-in-package technology: its early development. IEEE Antennas Propag Mag 2019;61(3):111–8. link1

[ 4 ] Liu D, Zhang YP. Integration of array antennas in chip package for 60-GHz radios. Proc IEEE 2012;100(7):2364–71. link1

[ 5 ] Zhang YP, Sun M, Liu D, Lu Y. Dual grid array antennas in a thin-profile package for flip-chip interconnection to highly integrated 60-GHz radios. IEEE T Antenna Propag 2011;59(4):1191–9. link1

[ 6 ] Elisabeth S, Malaquin C. Antenna in package (AiP): disrupting wireless communication and HMI. Chip Scale Rev 2020;24(1):4–7. link1

[ 7 ] Rappaport TS, Heath RW, Daniels RC, Murdock JN. Millimeter wave wireless communication. New York: Pentice-Hall; 2015. link1

[ 8 ] Issakov V, Wojnowski M, Knapp H, Trotta S, Forstner HP, Pressel K, et al. Cosimulation and co-design of chip-package-board interfaces in highlyintegrated RF systems. In: Proceedings of 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM); 2016 Sep 25–27; New Brunswick, NJ, USA; 2016. p. 94–101.

[ 9 ] Wang JJ, Zhang YP, Chua KM, Lu ACW. Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers. IEEE T Antenna Propag 2005;53(12): 3877–83. link1

[10] Zhang YP, Mao JF. An overview of the development of antenna-in-package technology for highly integrated wireless devices. Proc IEEE 2019;107(11): 2265–80. link1

[11] Kyriazidou CA, Contopanagos HF, Alexopoulos NG. Space-frequency projection of planar AMCs on integrated antennas for 60 GHz radios. IEEE T Antenna Propag 2012;60(4):1899–909. link1

[12] Liu D, Gu X, Baks CW, Valdes-Garcia A. Antenna-in-package design considerations for Ka-band 5G communication applications. IEEE T Antenna Propag 2017;65(12):6372–9. link1

[13] Brunnbauer M, Fürgut E, Beer G, Meyer T. Embedded wafer level ball grid array (eWLB). In: Proceedings of 2006 8th Electronics Packaging Technology Conference; 2006 Dec 6–8; Singapore; 2006.

[14] Nasr I, Jungmaier R, Baheti A, Noppeney D, Bal JS, Wojnowski M, et al. A highly integrated 60 GHz 6-channel transceiver with antenna in package for smart sensing and short-range communications. IEEE J Solid St Circ 2016;51(9): 2066–76. link1

[15] Tsai CH, Hsu CW, Kao KY, Tang TC, Lu CL, Wu KC, et al. Fabrication and characterization of millimeter wave 3D InFO dipole antenna array integrated with CMOS front-end circuits. In: Proceedings of 2019 IEEE International Electron Devices Meeting (IEDM); 2019 Dec 7–11; San Francisco, CA, USA; 2019.

[16] Yu B, Qian Z, Lin C, Lin J, Zhang YP, Yang G, et al. A wideband mmWave antenna in fan-out wafer level packaging with tall vertical interconnects for 5G wireless communication. IEEE T Antenna Propag 2021;69(10):6906–11. link1

[17] Zheng Z, Zhang YP, Shi L, Wu L, Mao JF. An overview of probe-based millimetre-wave/terahertz far-field antenna measurement setups. IEEE Antennas Propag Mag 2021;63(2):63–118. link1

[18] Moreira J. Testing AiP modules in high-volume production for 5G applications. Chip Scale Rev 2020;24(6):31–6. link1

[19] Zhang YP, Liu D. Antenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications. IEEE T Antenna Propag 2009;57(10):2830–41. link1