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Frontiers of Information Technology & Electronic Engineering >> 2016, Volume 17, Issue 1 doi: 10.1631/FITEE.1500167

Antenna-in-package system integrated with meander line antenna based on LTCC technology

Received: 2015-05-20 Accepted: 2016-01-05 Available online: 2016-01-05

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Abstract

We present an antenna-in-package system integrated with a based on technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a was fabricated and the experimental results agreed with simulations well.

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