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Frontiers of Environmental Science & Engineering >> 2011, Volume 5, Issue 2 doi: 10.1007/s11783-011-0308-4
Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing
1. School of Environment, Tsinghua University, Beijing 100084, China; 2. Faculty of Science and Technology, University of Macau, Macau 999078, China
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