2005, Volume 7, Issue 12
Strategic Study of CAE >> 2005, Volume 7, Issue 12
Thermodynamic Analysis of Thermoelectric Process and Measurement for Seebeck Coefficient of Thermoelectric Material
Dept, of Thermal Science & Energy Engineering, USTC, Hefei 230027, China
Next Previous
Abstract
A basic model of semiconductor thermoelectric generator is constituted. Based on the steady conduction equation, thermodynamic process has been analyzed. Temperature function, output power and generating efficiency of p and n semiconductor are obtained. The Seebeck coefficient S of a kind of Bi-Te-Sb-Se thermoelectric material at low temperature has been experimentally researched. Based on the experiment, the function between S and T of this material has been expressed. The conclusion indicates that this kind of thermoelectric material is unsuitable for power generation at low temperature, and only the enhancement of production technology or appearance of new production method can improve the electrical power generation performance.
Keywords
semiconductor ; thermoelectric ; thermodynamic process ; Seebeck coefficient
Figures
图1
图2
图3
图4
References
[ 1 ] 吴丽清, 陈金灿, 严子浚.半导体温差发电器的输出功率[J].厦门大学学报 (自然科学版) , 1996, 35 (2) :210~213 link1
[ 2 ] I.B.卡多夫, E.密勒.温差电材料和器件[M].周梦庐译.上海:上海科学技术出版社, 1964 link1
[ 3 ] Lampinen M J.Thermodynamic analysis ofthermoelectric generator[J].J Appl Phys, 1991, 69 (8) :4318~4323
[ 4 ] 刘宏, 王继扬.半导体热电材料研究进展[J].功能材料, 2000, 31 (2) :116~118 link1
[ 5 ] 张华俊, 陈浩, 王俊, 等.半导体热电堆电臂尺寸之研究[J].太阳能学报, 2002, 23 (2) :154~159 link1
[ 6 ] Mateeva N, Niculescu H, Schlenoff J, et al.Correlation of Seebeck coefficient and electricconductivity in polyaniline and polypyrrole[J].J ApplPhys, 1995, 83 (6) :3111~3117
[ 7 ] Venkatasubramanian R, Silvola E, Colpitts T, et al.Thin-film thermoelectric devices with high room-temperature figures of merit[J].Nature, 2001, 413 (11) :597~602
[ 8 ] Lei Jia, Zeshao Chen, Peng Hu, et al.Experimentalresearch on performance of Bi-Te-Sb-Se thermoelectricmaterial at low-temperature[A].Wang b.x.Proceedings of the 7th Asian ThermophysicalProperties Conference[C].Hefei, 2004
京公网安备 11010502051620号
