Strategic Study of CAE >> 2012, Volume 14, Issue 11
Experimental study of free abrasive wire sawing for multi strands wire
Key Laboratory of Mechanical Manufacture and Automation, Ministry of Education, Zhejiang University of Technology, Hangzhou 310032, China
Next Previous
Abstract
Grains in the slurry enter into cutting area by steel wire with a certain speed and remove the workpiece material in the free brasive wire sawing. Multi-strands wire is made by metal wires and has many grooves in the surface compared with steel wire. Therefore it can carry more grains into cutting area and improve the slicing efficiency. In this paper, optical glass K9 were cut by multi strands wire (0.25 mm) and steel wire (0.25 mm).The results show that multi strands wire is better than steel wire in slicing efficiency and surface roughness, but the kerf loss is wider than steel wire under the same process conditions.
Keywords
References
[ 1 ] Liqun Zhu, Imin Kao. Galerkin-based modal analysis on the vibrati on of wire-slury system in wafer slicing using a wi resa w[J]. Journal of Sound and Vibration, 2005, 283:589-620. link1
[ 2 ] Bhagavat M, Prasad V, KaoI. Elasto-hydrodynamic interaction in the free abrasi ve wafer slicing using a wire saw: Modeling and finite element analysis [J]. Journal of Tribology, 2000, 122(4):394-404. link1
[ 3 ] Kao I, Bhagavat M, Prasad V, et al. Integrated mo de ling of wi re saw in wafer slicing [C]//NSF Design and Manufact uring Gran-tees Conference. Mont errey, Mexico, 1998: 425-426.
[ 4 ] Li J, Kao I, Prasad V. Modeling stresses of contacts in wire sa w slicing of poly-crystalline and crystalline ingots: Application to sil-icon wafer production[J]. Transactions of the ASME Joumal of Elec tron Packaging, 1998, 120 (2):123 -128 link1
[ 5 ] Moller H J. Basic mechanisms and model of multi wire sawing[J]. Advanced Engineering Materials ,2004,6 (7) : 501-513. link1
[ 6 ] Moller H J. Wafering of silicon crystals [J]. Physica Sta tus Solidi(a), 2006, 203(4):659-669. link1
[ 7 ] Bidiville A. Wasmer K. Michler J, et al. Mechanisms of wafer sawing and impact on wafer properties [J]. Progress in Photo-voltaics: Research and Applications, 2010, 18 (8):563-572. link1
[ 8 ] Ishikawa K I, Suwabe H, Itoh s I, et al. A basic study on thebehavior of slurry action at multi-wire saw[J]. Key Enginee ring Materials, 2003, 238 -239: 89 -92. link1
[ 9 ] Ishikawa K I, Suwabe H, Itoh S I. Relationship between slurry actions in slicing groove and slicing charac teristics at multi-wire saw [J]. Joumal of the Japan Society of Precision Enginee ring,2003, 69: 1739-1743.
[10] Bi diville A, Wasmer K, Kraft R, et al. Diamond wiresawn sili-con wafers -from the lab to the cell production [C]//Proc eedings of the 24th EU PV-SEC, 2009:1400 -1405.