Resource Type

Journal Article 2

Year

2015 2

Keywords

CMP 1

Cu interconnects 1

connotation 1

construction megaproject (CMP) 1

eddy current 1

equivalent unit 1

grounded theory 1

multilayer wafer 1

organizational citizenship behavior 1

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Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

Zilian QU,Yonggang MENG,Qian ZHAO

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 1,   Pages 1-6 doi: 10.1007/s11465-015-0325-2

Abstract: measurement of the top copper film of multilayer interconnects in the chemical mechanical polishing (CMP

Keywords: CMP     eddy current     multilayer wafer     Cu interconnects     equivalent unit    

Research on Multidimensional Connotations of Megaproject Construction Organization Citizenship Behavior

Qing-hua He,De-lei Yang,Yong-kui Li,Lan Luo

Frontiers of Engineering Management 2015, Volume 2, Issue 2,   Pages 148-153 doi: 10.15302/J-FEM-2015024

Abstract: context characteristics of construction megaprojects (CMPs), a multidimensional connotation model of CMP

Keywords: construction megaproject (CMP)     organizational citizenship behavior     connotation     grounded theory    

Title Author Date Type Operation

Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

Zilian QU,Yonggang MENG,Qian ZHAO

Journal Article

Research on Multidimensional Connotations of Megaproject Construction Organization Citizenship Behavior

Qing-hua He,De-lei Yang,Yong-kui Li,Lan Luo

Journal Article