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Journal Article 6

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2022 1

2021 2

2018 1

2008 1

2007 1

Keywords

subsurface damage 3

SH-wave 1

advancement 1

amorphous phase 1

backgrinding 1

box-lined tunnel 1

brittle materials 1

brittle-ductile transition 1

critical undeformed chip thickness 1

ductile mode cutting 1

grinding process 1

half-plane BEM 1

machining mechanism 1

mechanism 1

molecular dynamic simulation 1

monocrystalline beta-phase gallium oxide 1

nanocrystals 1

recovery 1

silicon wafer 1

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On subsurface box-shaped lined tunnel under incident SH-wave propagation

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4, Pages 948-960 doi: 10.1007/s11709-021-0740-x

Abstract: half-plane time-domain boundary element method is applied to obtain the seismic ground response, including a subsurfaceThe results showed that subsurface openings with sharp corners distorted the propagation path of the

Keywords： box-lined tunnel half-plane BEM surface response SH-wave time-domain

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Subsurface damage pattern and formation mechanism of monocrystalline -GaO in grinding process

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 2, doi: 10.1007/s11465-022-0677-3

Abstract: Transmission electron microscopy was used to observe the subsurface damage in rough, fine, and ultrafineThe subsurface damage thickness of the samples decreased with the reduction in the grit radius and theSubsurface damage models for grinding process were established on the basis of the grinding principle

Keywords： monocrystalline beta-phase gallium oxide grinding process subsurface damage nanocrystals amorphous

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Relationships between loading rates and nitrogen removal effectiveness in subsurface flow constructed

ZHANG Rongshe, LI Guanghe, ZHANG Xu, ZHOU Qi

Frontiers of Environmental Science & Engineering 2008, Volume 2, Issue 1, Pages 89-93 doi: 10.1007/s11783-008-0002-3

Abstract: Nitrogen removal of wetlands under 40 different inflow loadings were studied in the field during 15 months. The removal efficiency of four different sets of beds, namely the reed bed, the Zizania caduciflor bed, the mixing planting bed, and the control bed were studied. The outflow loading and total nitrogen (TN) removal rate of these beds under different inflow loadings and pollution loadings were investigated. The inflow loadings of 4 sub-surface flow systems (SFS) ranged from 400 to 8000 mg·(m·d), while outflow loadings were less than 7000 mg·(m·d). The results showed that the inflow and outflow loading of TN removal rate in SFS presented an obvious linear relationship. The optical inflow loading to run the system was between 2000 to 4000 mg·(m·d). Average removal rate was between 1062 and 2007 mg·(m·d). SFS with plant had a better removal rate than the control. TN removal rates of the reed and Zizania caduciflora bed were 63% and 27% higher than the control bed, respectively. The results regarding the TN absorption of plants indicated that the absorption amount was very limited, less than 5% of the total removal. It proved that plants clearly increase TN removal rates by improving the water flow, and increasing the biomass, as well as activities of microorganisms around the roots. The research provided a perspective for understanding the TN removal mechanism and design for SFS.

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Theoretical and experimental analysis on super precision grinding of monocrystal silicon

GUO Xiaoguang, GUO Dongming, KANG Renke, JIN Zhuji

Frontiers of Mechanical Engineering 2007, Volume 2, Issue 2, Pages 137-143 doi: 10.1007/s11465-007-0023-9

Abstract: investigating the diamond-silicon grinding system, the grinding mechanism, including chip removal and subsurfaceabrasive surface is fractured, and then the amorphous layers are formed and propagated, which causes the subsurface

Keywords： machining mechanism recovery advancement mechanism subsurface

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A review on ductile mode cutting of brittle materials

Elijah Kwabena ANTWI, Kui LIU, Hao WANG

Frontiers of Mechanical Engineering 2018, Volume 13, Issue 2, Pages 251-263 doi: 10.1007/s11465-018-0504-z

Abstract: characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurfacebelieved that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface

Keywords： ductile mode cutting brittle materials critical undeformed chip thickness brittle-ductile transition subsurface

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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3, Pages 559-569 doi: 10.1007/s11465-020-0624-0

Abstract: different thicknesses to investigate the effects of taping on peak-to-valley (PV), surface roughness, and subsurfaceHowever, the PV value, surface roughness, and subsurface damage of silicon wafers with taping deterioratedThe surface roughness and subsurface damage of silicon wafers with taping decreased with increasing mesh

Keywords： taping silicon wafer backgrinding subsurface damage surface roughness