正文
《化学科学与工程前沿(英文)》 >> 2007年 第1卷 第4期 doi: 10.1007/s11705-007-0060-2
Preparation and rheological behaviors of PA6/SiO2 nanocompiste
1.College of Packaging and Printing, Hunan University of Technology, Zhuzhou 412008, China; 2.The Institute of Polymer Science, Xiangtan University, Xiangtan 411105, China; 3.College of Civil Engineering and Mechanics, Xiangtan University, Xiangtan 411105, China;
摘要
关键词
polyamide ; temperature ; rheological ; activation ; pesudoplastic
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