正文
《机械工程前沿(英文)》 >> 2021年 第16卷 第3期 doi: 10.1007/s11465-020-0624-0
Effects of taping on grinding quality of silicon wafers in backgrinding
. Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China.. CIMS Institute, School of Mechanical Engineering, Hefei University of Technology, Hefei 230009, China
摘要
正文