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Frontiers of Mechanical Engineering >> 2006, Volume 1, Issue 2 doi: 10.1007/s11465-006-0011-5
The electrostatic-alloy bonding technique used in MEMS
MEMS Center, Harbin Institute of Technology, Harbin 150001, China
Abstract
Keywords
Si/Au-glass ; strength ; MEMS packaging ; process ; sandwich structure
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