4Pi荧光超分辨显微术综述

郝翔 ,  李依明 ,  傅爽 ,  李旸晖 ,  许迎科 ,  匡翠方 ,  刘旭

工程（英文） ›› 2022, Vol. 11 ›› Issue (4) : 146 -153.

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工程（英文） ›› 2022, Vol. 11 ›› Issue (4) : 146 -153. DOI: 10.1016/j.eng.2020.07.028

4Pi荧光超分辨显微术综述

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Review of 4Pi Fluorescence Nanoscopy

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摘要

自20 世纪90 年代以来，持续的科技进步突破了光学显微镜的衍射极限，使三维超分辨显微成像技术得以实现。回顾这些历程，一个重要的里程碑是基于两个对置物镜的4Pi 显微架构及其超分辨版本的出现。鉴于此，本文综述了4Pi 超分辨显微术的近期进展。总体上，4Pi 超分辨显微镜为透明样品观测提供了一
种能够突破衍射极限、非侵入、各向同性的三维分辨率的技术手段。具体而言，本文针对目标开关和随机开关两个主要4Pi 超分辨显微术版本，讨论了它们的架构、原理、应用和未来发展趋势。

Abstract

Since the 1990s, continuous technical and scientific advances have defied the diffraction limit in microscopy and enabled three-dimensional (3D) super-resolution imaging. An important milestone in this pursuit is the coherent utilization of two opposing objectives (4Pi geometry) and its combination with super-resolution microscopy. Herein, we review the recent progress in 4Pi nanoscopy, which provides a 3D, non-invasive, diffraction-unlimited, and isotropic resolution in transparent samples. This review includes both the targeted and stochastic switching modalities of 4Pi nanoscopy. The schematics, principles, applications, and future potential of 4Pi nanoscopy are discussed in detail.

关键词

荧光超分辨显微术 / 超分辨成像 / 4Pi超分辨显微术 / isoSTED / 4Pi-SMLM

Key words

Fluorescence nanoscopy / Super-resolution imaging / 4Pi nanoscopy / IsoSTED / 4Pi-SMLM

引用本文

引用格式 ▾
郝翔,李依明,傅爽,李旸晖,许迎科,匡翠方,刘旭. 4Pi荧光超分辨显微术综述[J]. 工程（英文）, 2022, 11(4): 146-153 DOI:10.1016/j.eng.2020.07.028

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1、 引言

多年来，移动终端的天线设计已经变得越来越困难。这主要是由于这类设备的空间有限，无法容纳具有宽频带和多频带要求的多根天线。即将到来的第五代（5G）无线通信使这个问题对移动终端天线设计者来说更具挑战性，因为它需要在低于6 GHz的频段上使用大量的多输入多输出（MIMO）天线，以及在毫米波频段上使用两个或三个天线封装（AiP）模块。在这些天线设计中，天线必须小型化、布局紧凑、低剖面、重量轻，同时保持宽带和多频段性能。此外，对于MIMO天线的设计，虽然天线放置非常紧密，但天线之间必须保持高度隔离，即使是在同一频段内也是如此。本文对未来移动终端的天线设计进行了概述。

2、 天线设计环境和要求

移动终端通常包括智能手机、笔记本电脑、平板电脑、移动无线保真（MiFi）、数据卡、智能手表、蓝牙（BT）耳机、路由器、物联网（IoT）、智能屏幕、用户驻地设备（CPE）、增强现实（AR）设备、虚拟现实（VR）设备和汽车。移动终端的天线设计技术对移动终端的工业设计（ID）、架构、电池容量、通话和待机时间、用户体验、市场准入、通信能力和法律要求有非常大的影响。人们普遍认为，由于智能手机的时尚ID、高度集成的架构以及与人体的交互，使得智能手机天线的设计成为天线工程师面临的最具挑战性的任务。图1显示了一个简化的智能手机天线设计环境，其包括一个金属框架、一个印刷电路板（PCB）/显示金属面板、一个电池以及一些组件。这些组件包括一个通用串行总线（USB接口）、一个用户识别模块（SIM）卡座、一个音频视频（AV）插孔、一个电源键和一个音量键。金属框架和PCB/显示器金属面板之间的间隙通常小于1.0 mm，以实现大的屏占比。在金属框架和PCB/显示器金属面板之间有许多连接点，以便为天线建立接地点。金属框架可以被切割成一些开口槽，使天线辐射器在一侧形成短路，在另一侧形成开路，以便将天线尺寸从半波长减少到四分之一波长，提高天线带宽和效率。对于5G智能手机来说，所需的天线为：

图1 智能手机的简化天线设计环境。PCB：印刷电路板；SIM：用户识别模块；USB：通用串行总线；AV：音频视频。

·多频段主天线：长期演进（LTE）/新无线电（NR）（698~960 MHz和1710~2690 MHz）；

·多频段分集天线：LTE/NR（698~960 MHz和1710~2690 MHz）；

·4×4 MIMO天线：LTE/NR（1710~2690 MHz）；

·4×4 MIMO天线：NR（3300~5000 MHz）；

·全球导航卫星系统（GNSS）天线：GPS/GLONASS/Galileo/BeiDou（1176 MHz和1575~1609 MHz）；

·三波段2×2 MIMO天线：无线保真（WiFi）（2400~2484 MHz、5150~5350 MHz和5725~5825 MHz）；

·三个双频超宽带（UWB）天线：UWB（6240~6740 MHz和7750~8250 MHz）；

·两个或三个毫米波AiP模块：AiP（24.25~29.50 MHz和37.00~43.50 GHz）；

天线总数为15~20根，如果实施载波聚合（CA）/E-UTRAN新无线双路连接（ENDC）和8×8 MIMO，天线总数还可以进一步增加到25~30根。除了需要大量的天线外，所有的天线都必须符合相关的设计规范，其中包括带宽、自由空间的效率、手握和头旁的效率、天线之间的隔离、功率谱密度（PSD）和（人体）特别吸收率（SAR）。由于金属框架的金属尺寸和离地位置，其通常被作为大多数天线的最佳辐射器，特别是对于中低频段的LTE/NR主天线和分集天线来说。地面天线，如平面倒F天线（PIFA）、贴片和毫米波AiP模块，可以放置在PCB/显示器金属面板上方或电池盖的背面；但是，这些天线的工作频率一般需要高于3.0 GHz才能保证良好的性能，因为这些天线的高度通常不超过1.0 mm。此外，光学透明的天线可以放在移动终端的显示屏上，以减少人体对天线性能的影响，提高天线辐射模式的覆盖率[1]。

3、 移动终端天线的概念

如图2所示，传统的移动终端天线概念可分为：①倒F天线（IFA）/PIFA [2]；②单极天线[3]；③环形天线[4]；④复合右手和左手（CRLH）启发式天线[5]；⑤单极槽天线[6]。这些天线的工作原理在参考文献[7‒8]中都有详细的记载。除了传统的概念外，可重构天线——主要是频率可重构天线[9]——已被广泛用于移动终端天线设计，以扩大其阻抗带宽。具有模式和偏振可重构功能的天线在MIMO应用中也变得越来越引人注意[10]。

图2 传统的移动终端天线的概念。IFA：倒F天线；PIFA：平面倒F天线；CRLH：复合右手和左手。

与基站、机载雷达和许多其他类型的通信设备的天线设计不同，很少有系统的理论和复杂的方法来设计移动终端的天线，即使这项任务变得越来越复杂和具有挑战性，特别是对于未来的移动终端。原因是广泛使用的移动终端天线作为共模（CM）运行，具体如图2所示。这些共模天线主要通过其“环境”进行辐射，即直接和间接连接到天线的金属部件，如PCB和整个移动终端内的所有金属部件。与其他任何与主导差分模式（DM）相关的天线相比，在移动终端天线设计中利用CM的主要优点包括更小的天线尺寸、更大的辐射孔径、更宽的阻抗带宽和更高的辐射效率。其缺点是难以控制天线辐射模式。但是，由于移动终端的方向可以是任意的，因此在移动终端天线设计中，天线辐射效率比天线辐射模式更关键。这反映在所需的空中（OTA）性能上，包括总辐射功率（TRP）和总辐射灵敏度（TRS），它们分别由无线电频率（RF）前端的传导功率和传导灵敏度与天线辐射效率共同定义。由于引入了CM和“环境”辐射，移动终端天线设计的复杂性和难度都显著增加。

如第2节所述，对于智能手机的天线设计，必须在一个非常有限的空间内安排非常多的天线。这个问题的传统解决方案是采用双工器和多工器来设计覆盖宽频带和多频带的单馈共辐射器天线。除了上述天线概念外，最近还提出了用于设计移动终端的单馈宽频和多频带天线的CM和DM概念[11]。所提出的天线最突出的特点之一是在天线设计中同时采用CM和DM。这个提出的天线概念定义了线CM/DM和槽CM/DM单元天线，其中天线单元必须以不对称的方式放置或馈电，以实现宽频带或多频带的功能。与移动终端天线的所有其他天线概念相比，线型DM和槽型DM，即半波长偶极子模式和半波长槽型已被引入，以创造额外的共振，从而增加带宽。更高阶的模式也可以被激发以进一步提高天线的带宽。由于所提出的线型CM/DM和槽型CM/DM的设计方法比传统方法更加严格和系统，预计它将对未来移动终端的天线设计产生重大影响并得到广泛的应用。

对于一个典型的5G NR MIMO天线设计，需要两根工作在相同频段的天线，同时，尽管由于设计环境非常拥挤，通常天线的位置很近，但两根天线之间必须满足高隔离度。显然，这种设计困难不能通过利用滤波器、双工器和复用器来规避。为了节省天线体积，并在有限的空间内放置更多的天线，研究人员提出了将两根天线设计成一对的概念[12]，并通过利用互补电流分布的原理获得良好的隔离效果。为了进一步解决这个问题，研究人员提出了一种正交模式设计方法[13]。天线对中的两根天线在对称位置时具有正交极化，两根天线之间实现了良好的隔离。另一个主要步骤是在设计具有相同频段和高隔离度的天线对时，明确定义了CM/DM的概念[14‒15]，尽管正交极化的特征在某种程度上与参考文献[13]中相似。但是，在上述提到的所有天线对中，两根天线要么是线型，要么是金属片型。参考文献[16]中提出了一个更全面和对称的概念。在这个天线概念中，定义了四个单元天线：CM线、DM线、CM槽和DM槽。因此，有六对由四个单元天线产生的配对组合。在这六对组合天线中，有四对是具有固有高隔离特性的天线对，这要归功于它们的正交极化，而另外两对天线中，如果将天线对中的一根天线旋转90°，也能获得高隔离度。这个提出的天线设计概念大大增加了设计5G NR MIMO天线的自由度，即从一自由度增加到六自由度。在参考文献[17‒18]中可以找到六对组合天线的两个设计实例。

常用的UWB天线是具有柔性基底的天线，它被放置在PCB/显示器金属面板之上，以低损耗液晶聚合物（LCP）或改性聚酰亚胺（MPI）作为天线基底。UWB天线的设计通常是一个双频PIFA或偏移馈电双频贴片天线。由于其工作频率在6000 MHz以上，0.3~0.4 mm的天线高度足以覆盖所需的频段。毫米波AiP模块的设计与传统相控阵的设计类似。通常，一个AiP模块是一个贴片天线阵列或磁电（ME）偶极子[19]阵列，具有正交双极化的1×4或2×2天线元件。这种天线阵列设计的挑战在于满足宽频、多频、高增益、宽扫描角度、小尺寸和低高度的严格要求。智能手机中NFC天线的传统解决方案是与手机天线共用一段金属框架辐射器，使用混合分布式/块状电感作为低通滤波器。其他NFC天线的解决方案包括带有线圈的铁氧体片，或与移动终端的金属罩结合的线圈[20]。

4、 结论

未来的移动终端，特别是智能手机的天线设计正面临着巨大的挑战，因为这些设备的空间非常有限，天线数量众多，而且设计要求和规格非常严格。用于单馈和双馈天线的CM/DM天线概念为宽频、多频和5G NR MIMO天线的设计提供了全面和系统的解决方案。这些概念将在未来移动终端的天线设计领域得到广泛应用。

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