基于自动原位校准的大型飞机构件装配过程三维微位移监测系统
贾振元 , 梁冰 , 刘巍 , 刘坤 , 马建伟
工程(英文) ›› 2022, Vol. 19 ›› Issue (12) : 105 -116.
基于自动原位校准的大型飞机构件装配过程三维微位移监测系统
3D Microdisplacement Monitoring of Large Aircraft Assembly with Automated In Situ Calibration
三维(3D)微位移监测在大型飞机装配中起着至关重要的作用。本文提出了一种广泛适用的基于接近传感器的高精度在线3D微位移监测方法和系统,以及相应的原位校准方法,可应用于飞机装配过程中遇到的各种极端工作条件,如紧凑和遮挡的空间。首先建立了一个3D监测模型,仅基于接近传感器测量的一
维距离实现3D微位移监测,该模型涉及传感器外部参数,如测量原点(PBP)和单位位移矢量(UDV)。然后,结合空间变换原理和加权优化校准方法,获得高精度外部参数。最后,针对尾翼装配过程开展了校准和监测实验。PBP 的校准精度在X、Y 方向优于±10 μm,在Z 方向优于±2 μm,UDV 的校准精度优于0.07°。此外,3D微位移监测系统的精度可达到±15 μm。总体而言,本文为基于接近传感器的3D微位移监测的建模和校准提供了新的见解,并为飞机装配过程中紧凑空间内的几何测量提供了一种高精度、高效率、低成本的技术手段。
Three-dimensional (3D) microdisplacement monitoring plays a crucial role in the assembly of large aircraft. This paper presents a broadly applicable high-precision online 3D microdisplacement monitoring method and system based on proximity sensors as well as a corresponding in situ calibration method, which can be applied under various extreme working conditions encountered in the aircraft assembly process, such as compact and obstructed spaces. A 3D monitoring model is first established to achieve 3D microdisplacement monitoring based only on the one-dimensional distances measured by proximity sensors, which concerns the extrinsic sensor parameters, such as the probe base point (PBP) and the unit displacement vector (UDV). Then, a calibration method is employed to obtain these extrinsic parameters with high precision by combining spatial transformation principles and weighted optimization. Finally, calibration and monitoring experiments performed for a tailplane assembly process are reported. The calibration precision for the PBP is better than ±10 μm in the X and Y directions and ±2 μm in the Z direction, and the calibration precision for the UDV is better than 0.07°. Moreover, the accuracy of the 3D microdisplacement monitoring system can reach ±15 μm. In general, this paper provides new insights into the modeling and calibration of 3D microdisplacement monitoring based on proximity sensors and a precise, efficient, and low-cost technical means for performing related measurements in compact spaces during the aircraft assembly process.
| Methods | Main sensing devices | Measurement mode | Accuracy (at 7 m) | Remark |
|---|---|---|---|---|
| Refs. | 3D laser trackers | Optical, noncontact | < 0.100 mm | High accuracy, low efficiency, and invalid measurement of obstructed objects |
| Refs. | 2D cameras or laser scanners | Optical, noncontact | ~0.070‒1.000 mm | Low accuracy, high efficiency, and invalid measurement of obstructed objects |
| Refs. | 1D movable proximity sensors | Optical, noncontact or contact | ~0.010‒0.100 mm | High accuracy, high efficiency, sensors driven by manipulators, and equipment volume too large to permit measurement in a compact space |
| Proposed method | 1D fixed proximity sensors | Magnetic, noncontact | < 0.076 mm | High accuracy, high efficiency, compact sensor volume, and sensors distributed in the measurement space |
| Parameter (mm) | Mean | Standard deviation | |
|---|---|---|---|
| Pose 1 | O | [18.351 -132.296 131.764] | 10-3 × [4.99 8.55 1.12] |
| t | [-0.001 0.307 -0.949] | 0.0373° | |
| Pose 2 | O | [-28.151-135.772 133.268] | 10-3 × [4.82 8.55 0.79] |
| t | [-0.031 0.282 -0.955] | 0.0482° | |
| Pose 3 | O | [29.461 90.590 132.799] | 10-3 × [6.38 7.24 0.30] |
| t | [0.037 0.307 -0.951] | 0.0635° | |
| Pose 4 | O | [-19.378 91.536 131.732] | 10-3 × [4.13 4.97 0.20] |
| t | [-0.053 0.233 -0.971] | 0.0314° | |
| Sensor number | OX (mm) | OY (mm) | OZ (mm) | tX | tY | tZ |
|---|---|---|---|---|---|---|
| SP 1 sensor | -1680.845 | -748.645 | 123.805 | -0.028 | 0.910 | -0.414 |
| AP 1 sensor | -1871.246 | -480.598 | 109.775 | 0.326 | -0.197 | -0.925 |
| AP 2 sensor | -1742.015 | -469.605 | 106.003 | -0.116 | 0.993 | 0.021 |
| HP 1 sensor | -1870.849 | -229.299 | 115.794 | 0.007 | -0.210 | -0.978 |
| HP 2 sensor | -1717.989 | -209.531 | 81.399 | 0.279 | 0.946 | -0.163 |
| SP 2 sensor | -1672.594 | 571.228 | 113.139 | 0.080 | 0.992 | -0.096 |
| Assembly process stage | SP 1 (μm) | AP 1 (μm) | AP 2 (μm) | HP 1 (μm) | HP 2 (μm) | SP 2 (μm) |
|---|---|---|---|---|---|---|
| Prework | ||||||
| d (Dur.) | 0 | 0 | 0 | 0 | 0 | 0 |
| D (Aft.) | [0 0 0] | [0 0 0] | [0 0 0] | [0 0 0] | [0 0 0] | [0 0 0] |
| Spar | ||||||
| d (Dur.) | -57.7‒56.2 | -4.4‒4.6 | -4.2‒4.4 | -3.9‒4.8 | -4.7‒4.1 | -71.2‒69.8 |
| D (Aft.) | [-0.1 2.3 -1.0] | [0 0 0] | [0 0 0] | [0 0 0] | [0 0 0] | [-0.2 -3.1 0.3] |
| Actuator | ||||||
| d (Dur.) | -33.1‒38.0 | -17.8‒18.4 | -44.5‒42.3 | -4.5‒4.7 | -5.1‒3.9 | -20.9‒14.6 |
| D (Aft.) | [-0.1 1.6 -0.7] | [-0.2 -0.1 0.6] | [-0.3 2.4 0.1] | [0 0 0] | [0 0 0] | [-0.1 -1.8 0.2] |
| Hinge | ||||||
| d (Dur.) | -24.8‒28.5 | -9.5‒8.2 | -19.8‒24.6 | -25.4 ‒25.7 | -56.7‒59.2 | -19.6‒15.9 |
| D (Aft.) | [-0.1 2.6 -1.2] | [-0.2 0.1 0.6] | [-0.3 2.4 0.1] | [0 -0.1 -0.7] | [0.7 2.3 -0.4] | [-0.2 -2.5 0.2] |
| Lower panel | ||||||
| d (Dur.) | -63.9‒69.5 | -20.7‒19.3 | -50.8‒55.7 | -21.5‒22.9 | -62.6‒67.3 | -82.4‒77.5 |
| D (Aft.) | [-0.1 1.7 -0.8] | [-0.1 0.1 0.3] | [-0.2 1.7 0] | [0 -0.2 -1.0 | [1.1 3.6 -0.6] | [-0.3 -4.0 0.4] |
| Upper panel | ||||||
| d (Dur.) | -60.4‒64.2 | -18.0‒17.5 | -44.1‒47.5 | -19.0‒21.0 | -54.0‒61.4 | -79.6‒71.5 |
| D (Aft.) | [0 1.5 -0.7] | [-0.1 0 0.2] | [0.1 -0.9 0] | [0 0.1 0.5] | [0.4 1.5 -0.3] | [0.1 1.7 -0.2] |
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