高速运动精密定位是微电子封装设备中高加速轻载执行机构的基本运动需求。本文推导了高加速机构瞬态非线性动力学响应方程，揭示了刚度、频率、阻尼 (与材料空间布局相关) 和驱动频率 (与运动规划相关) 是主要影响因素。据此，在满足高加速机构精密定位的条件下，笔者提出了一种基于最优非线性动力学响应的结构优化和速度规划新方法。在结构优化中，首先分析了目前流行的基于等效静态载荷的柔性多体动力学优化方法未充分考虑惯性载荷的不足，然后提出了基于等效模态的柔性多体动力学最优动态响应优化新方法；在速度规划上，针对传统的几何光滑方法不能反映系统动态特性的缺陷，提出了基于变边界条件非线性动力学响应优化的速度规划新方法。将所提方法应用到高速固晶焊头的优化设计中，通过结构优化，降低振幅超过20%，再经非对称变加速规划，缩短定位时间超过40%。本文提出的方法为微电子封装类装备等高加速轻载机构精密定位的实现提供了有效的理论支撑和解决途径。

High-speed and precision positioning are fundamental requirements for high-acceleration low-load mechanisms in integrated circuit (IC) packaging equipment. In this paper, we derive the transient nonlinear dynamicresponse equations of high-acceleration mechanisms, which reveal that stiffness, frequency, damping, and driving frequency are the primary factors. Therefore, we propose a new structural optimization and velocity-planning method for the precision positioning of a high-acceleration mechanism based on optimal spatial and temporal distribution of inertial energy. For structural optimization, we first reviewed the commonly flexible multibody dynamic optimization using equivalent static loads method (ESLM), and then we selected the modified ESLM for optimal spatial distribution of inertial energy; hence, not only the stiffness but also the inertia and frequency of the real modal shapes are considered. For velocity planning, we developed a new velocity-planning method based on nonlinear dynamic-response optimization with varying motion conditions. Our method was verified on a high-acceleration die bonder. The amplitude of residual vibration could be decreased by more than 20% via structural optimization and the positioning time could be reduced by more than 40% via asymmetric variable velocity planning. This method provides an effective theoretical support for the precision positioning of high-acceleration low-load mechanisms.