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Simulation on refrigerant flow in adiabatic capillary tube
WANG Meixia, LIU Cunfang, ZHOU Qiangtai
《机械工程前沿(英文)》 2008年 第3卷 第3期 页码 332-336 doi: 10.1007/s11465-008-0054-x
关键词: mathematical diameter literature sub-cooling adiabatic capillary
A state-of-the-art review of solar passive building system for heating or cooling purpose
Arun Kumar NANDA,C K PANIGRAHI
《能源前沿(英文)》 2016年 第10卷 第3期 页码 347-354 doi: 10.1007/s11708-016-0403-0
关键词: HVAC heating cooling solar heating carbon dioxide (CO2) emissions
Green Construction of National Speed Skating Oval
《工程管理前沿(英文)》 2022年 第9卷 第1期 页码 170-176 doi: 10.1007/s42524-021-0177-x
关键词: super large-span cable net structure CO2 Transcritical Direct-cooling Ice Making System dynamic high-precision construction measurement green construction National Speed Skating Oval
Study on forced air convection cooling for electronic assemblies
LI Bin, TAO Wenquan, HE Yaling
《能源前沿(英文)》 2008年 第2卷 第2期 页码 158-163 doi: 10.1007/s11708-008-0009-2
关键词: concept slotted air-cooling Preliminary computation generation
Energy efficiency of small buildings with smart cooling system in the summer
Yazdan DANESHVAR, Majid SABZEHPARVAR, Seyed Amir Hossein HASHEMI
《能源前沿(英文)》 2022年 第16卷 第4期 页码 651-660 doi: 10.1007/s11708-020-0699-7
关键词: smart home heating and cooling systems saving energy optimal consumption of energy
面向异构集成应用的“片上”嵌入式冷却技术的研究进展 Review
Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia
《工程(英文)》 2023年 第26卷 第7期 页码 185-197 doi: 10.1016/j.eng.2022.10.019
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chip modules, or in vertically stacked three-dimensional (3D) integrated circuits. Flux values have increased exponentially with a simultaneous reduction in chip size and a significant increase in performance, leading to increased heat dissipation. The electronics industry and the academic research community have examined various solutions to tackle skyrocketing thermal-management challenges. Embedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlike separable cold plates/heat sinks. Although embedding the cooling solution onto an electronic chip results in a high heat transfer potential, technological risks and complexity are still associated with the implementation of these technologies and with uncertainty regarding which technologies will be adopted. This manuscript discusses recent advances in embedded cooling, fluid selection considerations, and conventional, immersion, and additive manufacturing-based embedded cooling technologies.
Mark BOMBERG
《结构与土木工程前沿(英文)》 2010年 第4卷 第4期 页码 431-437 doi: 10.1007/s11709-010-0071-9
关键词: capillary active insulation integrated heating cooling and ventilation air conditioning (HVAC) and building enclosure dynamic insulation switchable thermal resistance variable U-value walls
《能源前沿(英文)》 2022年 第16卷 第2期 页码 321-335 doi: 10.1007/s11708-021-0741-4
关键词: biomass-fired cogeneration district heat production system absorption heat pump extraction steam cooling water low-pressure feedwater
A comprehensive energy solution for households employing a micro combined cooling, heating and power
Huayi ZHANG, Can ZHANG, Fushuan WEN, Yan XU
《能源前沿(英文)》 2018年 第12卷 第4期 页码 582-590 doi: 10.1007/s11708-018-0592-9
In recent years, micro combined cooling, heating and power generation (mCCHP) systems have attracted much attention in the energy demand side sector. The input energy of a mCCHP system is natural gas, while the outputs include heating, cooling and electricity energy. The mCCHP system is deemed as a possible solution for households with multiple energy demands. Given this background, a mCCHP based comprehensive energy solution for households is proposed in this paper. First, the mathematical model of a home energy hub (HEH) is presented to describe the inputs, outputs, conversion and consumption process of multiple energies in households. Then, electrical loads and thermal demands are classified and modeled in detail, and the coordination and complementation between electricity and natural gas are studied. Afterwards, the concept of thermal comfort is introduced and a robust optimization model for HEH is developed considering electricity price uncertainties. Finally, a household using a mCCHP as the energy conversion device is studied. The simulation results show that the comprehensive energy solution proposed in this work can realize multiple kinds of energy supplies for households with the minimized total energy cost.
关键词: energy hub micro combined cooling heating and power generation (mCCHP) thermal comfort robust optimization
Weiliang WANG, Zhe TIAN
《能源前沿(英文)》 2013年 第7卷 第2期 页码 155-160 doi: 10.1007/s11708-013-0244-z
关键词: radiant cooling system dedicated outdoor air system (DOAS) thermal comfort Taguchi method variance analysis
Dieter BOHN, Robert KREWINKEL
《能源前沿(英文)》 2009年 第3卷 第4期 页码 406-413 doi: 10.1007/s11708-009-0041-x
关键词: conjugate calculation effectiveness of effusion cooling multi-layer systems CMSX-4 NiAl-FG75
黄锐
《中国工程科学》 2008年 第10卷 第11期 页码 43-46
针对冷却塔中螺旋结构类型的气液交换塔,提出其内部螺旋塔板形状的设计方法,包括塔壁上外螺旋线和塔中心轴管上内螺旋线的位置确定,以及两线之间螺旋曲面板在平面上的拓扑尺寸。通过塔的几何参数确定螺旋曲面板设计的关键参数,可实现扭曲状塔板与塔壁及内轴的准确配合。
Liquid metal cooling in thermal management of computer chips
MA Kunquan, LIU Jing
《能源前沿(英文)》 2007年 第1卷 第4期 页码 384-402 doi: 10.1007/s11708-007-0057-3
关键词: tremendous computer performance generation management improvement
Peng GAO, Liwei WANG, Ruzhu WANG, Yang YU
《能源前沿(英文)》 2017年 第11卷 第4期 页码 516-526 doi: 10.1007/s11708-017-0511-5
关键词: solid sorption exhaust waste heat combined cooling and power system exergy efficiency
Minghou LIU, Yaqing WANG, Dong LIU, Kan XU, Yiliang CHEN
《能源前沿(英文)》 2011年 第5卷 第1期 页码 75-82 doi: 10.1007/s11708-010-0014-0
标题 作者 时间 类型 操作
Simulation on refrigerant flow in adiabatic capillary tube
WANG Meixia, LIU Cunfang, ZHOU Qiangtai
期刊论文
A state-of-the-art review of solar passive building system for heating or cooling purpose
Arun Kumar NANDA,C K PANIGRAHI
期刊论文
Study on forced air convection cooling for electronic assemblies
LI Bin, TAO Wenquan, HE Yaling
期刊论文
Energy efficiency of small buildings with smart cooling system in the summer
Yazdan DANESHVAR, Majid SABZEHPARVAR, Seyed Amir Hossein HASHEMI
期刊论文
A concept of capillary active, dynamic insulation integrated with heating, cooling and ventilation, air
Mark BOMBERG
期刊论文
evaluation of an improved biomass-fired cogeneration system simultaneously using extraction steam, cooling
期刊论文
A comprehensive energy solution for households employing a micro combined cooling, heating and power
Huayi ZHANG, Can ZHANG, Fushuan WEN, Yan XU
期刊论文
Indoor thermal comfort research on the hybrid system of radiant cooling and dedicated outdoor air system
Weiliang WANG, Zhe TIAN
期刊论文
Numerical investigation of the effectiveness of effusion cooling for plane multi-layer systems with different
Dieter BOHN, Robert KREWINKEL
期刊论文
Simulation and experiments on a solid sorption combined cooling and power system driven by the exhaust
Peng GAO, Liwei WANG, Ruzhu WANG, Yang YU
期刊论文