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PVD 1

diffusion 1

finite element analysis 1

lateral displacement 1

microtechnology 1

physical vapor deposition (PVD) 1

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surcharge load 1

transient liquid phase 1

vacuum consolidation 1

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Lateral displacement of soft ground under vacuum pressure and surcharge load

Chin-Yee ONG, Jin-Chun CHAI

Frontiers of Structural and Civil Engineering 2011, Volume 5, Issue 2, Pages 239-248 doi: 10.1007/s11709-011-0110-1

Abstract: Surcharge load (e.g. embankment fill) will induce settlement and outward lateral displacement, while vacuum pressure will induce settlement and inward lateral displacement of a ground. Ideally, combination of surcharge load and vacuum pressure can reduce or minimize the lateral displacement. Laboratory large scale model (length: 1.50 m, width: ~0.62 m, height: 0.85 m) tests and finite element analyses (FEA) were conducted to investigate the main influencing factors on lateral displacement of a soft clayey ground under the combination of vacuum pressure and surcharge load. For the conditions investigated, the results indicate that the outward lateral displacement increases with the increase of the ratio of surcharge load to vacuum pressure ( ) and the loading rate of the surcharge load ( ). Also, it is shown that for a given and condition, lateral displacement reduces with the increase of the initial undrained shear strength ( ) of the ground. To predict the lateral displacement of a ground under the combination of surcharge load and vacuum pressure, the loading conditions in terms of and , and value of the ground have to be considered.

Keywords： vacuum consolidation lateral displacement PVD finite element analysis surcharge load

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Development of new transient liquid phase system Au-Sn-Au for microsystem technology

Kirsten BOBZIN, Nazlim BAGCIVAN, Lidong ZHAO, Stefania FERRARA, Jan PERNE

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 4, Pages 370-375 doi: 10.1007/s11465-010-0107-9

Abstract: In the last decade, microsystems evolved to decisive technology in many technical applications. With increasing requirements on the performance of microsystems, more and more dissimilar materials are used in the same assembly. Correspondingly, suitable joining methods are required to fulfil the requirements on good properties of joints. In this study, a new transient liquid phase (TLP) system Au-Sn-Au was developed for potential medical applications in hybrid microsystems. The high and low melting phases Au and Sn were deposited onto diverse substrates by magnetron-sputter-ion plating. The coated substrates were soldered in a microsoldering station under different conditions. The influence of soldering conditions on the microstructure and properties of the joints was investigated. Results show that the developed solder led to high-quality joints that can be used in microsystems for medical applications.

Keywords： transient liquid phase microtechnology soldering diffusion physical vapor deposition (PVD)