Engineering in Situ Cu Electrodeposition and Ionization in the LEEFT-Cu System with a Stainless-Steel/Cu Core-Shell Electrode for Extended Water Disinfection
Wei Wang , Feiyang Mo , Mengkun Tian , Shuai Wang , Nathan Dong , Xing Xie
Engineering ›› : 202601016
Combining locally enhanced electric field treatment with copper disinfection (LEEFT-Cu) in coaxial-electrode copper ionization cells has shown effective microbial inactivation with low Cu concentration. However, a significant challenge remains with the current device design using a thin Cu wire as the cen-ter electrode. Continuous consumption of the center Cu electrode requires periodic system shutdown and disassembly for electrode replacement, while pitting corrosion of the electrode results in low Cu utiliza-tion efficiency. These issues restrict its suitability for long-term operation. Herein, we report the use of a stainless-steel/Cu core-shell (SS@Cu) wire electrode as a more durable alternative. The non-consumable SS core effectively prevents system failure due to breakdown of the center electrode and enables near-complete Cu release (∼ 100%). More importantly, the Cu shell is formed and regenerated directly within the LEEFT-Cu device through in situ Cu electrodeposition, avoiding the need for frequent system shut-down and wire replacement. The system operates in cycles of ∼ 25 h with only about half an hour required for SS@Cu electrode regeneration. These findings highlight the potential of the LEEFT-Cu system for extended operation in practical water disinfection.
Chlorine-free disinfection / Electric field treatment / Copper ionization cell / Microbial inactivation / Electroporation
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