Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor

Guoyou Liu , Rongjun Ding , Haihui Luo

Engineering ›› 2015, Vol. 1 ›› Issue (3) : 361 -366.

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Engineering ›› 2015, Vol. 1 ›› Issue (3) : 361 -366. DOI: 10.15302/J-ENG-2015043
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Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor

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Abstract

Based on the construction of the 8-inch fabrication line, advanced process technology of 8-inch wafer, as well as the fourth-generation high-voltage double-diffused metal-oxide semiconductor (DMOS+) insulated-gate bipolar transistor (IGBT) technology and the fifth-generation trench gate IGBT technology, have been developed, realizing a great-leap forward technological development for the manufacturing of high-voltage IGBT from 6-inch to 8-inch. The 1600 A/1.7 kV and 1500 A/3.3 kV IGBT modules have been successfully fabricated, qualified, and applied in rail transportation traction system.

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insulated-gate bipolar transistor (IGBT) / high power density / trench gate / 8-inch / rail transportation

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Guoyou Liu, Rongjun Ding, Haihui Luo. Development of 8-inch Key Processes for Insulated-Gate Bipolar Transistor. Engineering, 2015, 1(3): 361-366 DOI:10.15302/J-ENG-2015043

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