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Special issue: Micro-electromechanical systems (MEMS)
Zhuangde JIANG
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 457-458 doi: 10.1007/s11465-017-0492-4
Additive direct-write microfabrication for MEMS: A review
Kwok Siong TEH
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 490-509 doi: 10.1007/s11465-017-0484-4
Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the . The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.
关键词: direct-write additive manufacturing microfabrication MEMS
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 526-538 doi: 10.1007/s11465-017-0451-0
Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.
关键词: differential scanning calorimetry biomolecule MEMS thermodynamic
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 557-566 doi: 10.1007/s11465-017-0441-2
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.
关键词: thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package
《机械工程前沿(英文)》 2023年 第18卷 第2期 doi: 10.1007/s11465-023-0747-1
关键词: micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement
钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良
《中国工程科学》 2004年 第6卷 第7期 页码 21-25
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
《信息与电子工程前沿(英文)》 2015年 第16卷 第6期 页码 497-510 doi: 10.1631/FITEE.1400349
关键词: Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation
Development and application of high-end aerospace MEMS
Weizheng YUAN
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 567-573 doi: 10.1007/s11465-017-0424-3
This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.
关键词: MEMS design and manufacture technology aeronautic and aerospace
The electrostatic-alloy bonding technique used in MEMS
WANG Wei, CHEN Wei-ping
《机械工程前沿(英文)》 2006年 第1卷 第2期 页码 238-241 doi: 10.1007/s11465-006-0011-5
关键词: Si/Au-glass strength MEMS packaging process sandwich structure
蒸汽压力和超疏水纳米复合涂层对微电子器件可靠性的影响 Article
樊学军,陈良彪,汪正平,Hsing-Wei Chu,张国旗
《工程(英文)》 2015年 第1卷 第3期 页码 384-390 doi: 10.15302/J-ENG-2015034
由于高蒸汽压力可能导致微电子器件在高温和高湿度环境中失效,蒸汽压力的描述和模拟对研究微电子器件的湿度可靠性至关重要。为了最大程度地减小湿度的影响,可以在器件外表面涂抹一层超疏水涂层,以防止水分渗入。但是,超疏水涂层提高微电子器件可靠性的具体机制目前仍没有完全被理解。本文首先介绍了微电子高分子材料蒸汽压力的现有的一些理论。笔者还根据实验结果论述了超疏水涂层在防止水蒸气进入器件方面的机制和有效性。本文重点讨论了两个理论模型:基于微观力学的全场蒸汽压力模型和对流扩散模型。这两种方法都已成功用于说明无涂层样本的实验结果。但是,当器件上涂有超疏水纳米复合涂层时,笔者仍发现器件质量增加,其原因很可能是水蒸气可以透过超疏水涂层渗入。这种现象导致人们对超疏水涂层的有效性产生怀疑。根据理论和实验结果,笔者认为需要提出一种新的理论来理解水蒸气如何渗透超疏水涂层。
Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer
Lili CHEN, Wu ZHOU
《机械工程前沿(英文)》 2013年 第8卷 第2期 页码 146-149 doi: 10.1007/s11465-013-0260-z
To predict more precisely the frequency of force-balanced micro accelerometer with different bias voltages, the effects of bias voltages on error sensitivity of frequency is studied. The resonance frequency of accelerometer under closed loop control is derived according to its operation principle, and its error sensitivity is derived and analyzed under over etching structure according to the characteristics of Deep Reaction Ion Etching (DRIE). Based on the theoretical results, micro accelerometer is fabricated and tested to study the influences of AC bias voltage and DC bias voltage on sensitivity, respectively. Experimental results indicate that the relative errors between test data and theory data are less than 7%, and the fluctuating value of error sensitivity under the range of voltage adjustment is less than 0.01 μm . It is concluded that the error sensitivity with designed parameters of structure, circuit and process error can be used to predict the frequency of accelerometer with no need to consider the influence of bias voltage.
关键词: Micro-Electro-Mechanical Systems (MEMS) micro accelerometer force-balanced micro accelerometer frequency error sensitivity
利用微机电系统技术制作弯曲结构表面无线无源柔性加速度计 Research Article
李晨1,2,贾蔓谷1,洪应平2,薛亚楠2,熊继军2
《信息与电子工程前沿(英文)》 2022年 第23卷 第5期 页码 801-809 doi: 10.1631/FITEE.2100236
王渭源,王跃林
《中国工程科学》 2002年 第4卷 第6期 页码 56-62
对静电键合、体硅直接键合和界面层辅助键合等三种体硅键合技术,整片操作、局部操作和选择保护等三种密封技术,以及这些技术用于微电子机械系统的密封作了评述,强调在器件研究开始时应考虑封装问题,具体技术则应在保证器件功能和尽量减少芯片复杂性两者之间权衡决定。
关键词: 体硅键合技术 薄膜密封技术 微电子机械系统封装技术
标题 作者 时间 类型 操作
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
期刊论文
A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow
期刊论文
combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
期刊论文
Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer
Lili CHEN, Wu ZHOU
期刊论文
彭春荣:面向电力物联网的MEMS传感器技术(2020年8月17日)
2022年10月17日
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