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MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 557-566 doi: 10.1007/s11465-017-0441-2
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.
关键词: thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package
Special issue: Micro-electromechanical systems (MEMS)
Zhuangde JIANG
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 457-458 doi: 10.1007/s11465-017-0492-4
Additive direct-write microfabrication for MEMS: A review
Kwok Siong TEH
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 490-509 doi: 10.1007/s11465-017-0484-4
Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the . The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.
关键词: direct-write additive manufacturing microfabrication MEMS
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 526-538 doi: 10.1007/s11465-017-0451-0
Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.
关键词: differential scanning calorimetry biomolecule MEMS thermodynamic
Erratum to: Folded down-conversion mixer for a 60 GHz receiver architecture in 65-nm CMOS technology
Najam Muhammad AMIN,Zhi-gong WANG,Zhi-qun LI
《信息与电子工程前沿(英文)》 2015年 第16卷 第5期 doi: 10.1631/FITEE.14e0087
《机械工程前沿(英文)》 2023年 第18卷 第2期 doi: 10.1007/s11465-023-0747-1
关键词: micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement
基于变压器CMOS超宽带毫米波电路分析与设计综述 Review Articles
Yi-ming YU, Kai KANG
《信息与电子工程前沿(英文)》 2020年 第21卷 第1期 页码 97-115 doi: 10.1631/FITEE.1900491
钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良
《中国工程科学》 2004年 第6卷 第7期 页码 21-25
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
《信息与电子工程前沿(英文)》 2015年 第16卷 第6期 页码 497-510 doi: 10.1631/FITEE.1400349
关键词: Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation
基于电感和变压器跨导提升技术、噪声系数为3.2 dB、带宽为9.8–30.1 GHz的CMOS低噪声放大器
陈宏尘1,朱浩慎1,吴亮2,车文荃1,薛泉1
《信息与电子工程前沿(英文)》 2021年 第22卷 第4期 页码 586-598 doi: 10.1631/FITEE.2000510
郑维山,邓青,刘朝霞,时龙兴
《中国工程科学》 2009年 第11卷 第4期 页码 50-56
在CMOS单元电路自动优化中提出了一个新的设计方法。
高效节能计算的跨层设计:为实现每瓦特电力每秒千万亿次运算 Perspectives
Xiaobo Sharon HU, Michael NIEMIER
《信息与电子工程前沿(英文)》 2018年 第19卷 第10期 页码 1209-1223 doi: 10.1631/FITEE.1800466
Development and application of high-end aerospace MEMS
Weizheng YUAN
《机械工程前沿(英文)》 2017年 第12卷 第4期 页码 567-573 doi: 10.1007/s11465-017-0424-3
This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.
关键词: MEMS design and manufacture technology aeronautic and aerospace
一种用于工业级荧光光纤温度传感器的栅控双向静电放电器件的设计与优化 Research Article
汪洋1,金湘亮1,杨健1,严峰1,刘煜杰1,彭艳2,罗均2,杨军3
《信息与电子工程前沿(英文)》 2022年 第23卷 第1期 页码 158-170 doi: 10.1631/FITEE.2000504
关键词: 静电击穿;半导体器件可靠性;CMOS工艺
The electrostatic-alloy bonding technique used in MEMS
WANG Wei, CHEN Wei-ping
《机械工程前沿(英文)》 2006年 第1卷 第2期 页码 238-241 doi: 10.1007/s11465-006-0011-5
关键词: Si/Au-glass strength MEMS packaging process sandwich structure
标题 作者 时间 类型 操作
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
期刊论文
Erratum to: Folded down-conversion mixer for a 60 GHz receiver architecture in 65-nm CMOS technology
Najam Muhammad AMIN,Zhi-gong WANG,Zhi-qun LI
期刊论文
A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow
期刊论文
combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
期刊论文