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2019, Volume 20, Issue 4

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Frontiers of Information Technology & Electronic Engineering >> 2019, Volume 20, Issue 4 doi: 10.1631/FITEE.1800371

1.3-μm 4×25-Gb/s hybrid integrated TOSA and ROSA

1. State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
2. School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
3. State Key Laboratory of Advanced Optical Communications System and Networks, School of Electronics Engineering and Computer Science, Peking University, Beijing 100871, China
4. Microwave-Photonics Technology Laboratory, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China

Available online: 2019-06-05
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Abstract

The design and fabrication of a compact and low-cost 4×25-Gb/s transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) using a hybrid integrated technique are reported. TOSA and ROSA are developed without thermoelectric cooler for coarse wavelength division multiplexing applications. Physical dimension of the packaged optical subassembly is limited to 11.5 mm×5.4 mm×5.4 mm. The design of TOSA and ROSA is employed using a silica-based arrayed waveguide grating chip to select the specific channel wavelength at O-band. In TOSA, the wavelength of four 1.3-μm discrete directly modulated laser chips is well controlled based on the reconstruction equivalent chirp technique. In the back-to-back transmission test, bit error rates for all lanes of cascade of the TOSA and ROSA are small. A clear opening eye diagram is obtained.

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