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Frontiers of Information Technology & Electronic Engineering >> 2023, Volume 24, Issue 6 doi: 10.1631/FITEE.2200573
Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
Affiliation(s): School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China,Chengdu 610054,China; State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China,Chengdu 610054,China; Chengdu Micro-Technology Co., Ltd.,Chengdu 611731,China; less
Abstract
Keywords
Filtering packaging antenna (FPA) ; Through-glass vias (TGVs) ; 3D packaging devices ; Laser bonding
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