我国后端电子制造装备及其关键零部件发展研究

陈新 , 陈云 , 陈桪 , 吴小节

中国工程科学 ›› 2022, Vol. 24 ›› Issue (4) : 74 -84.

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中国工程科学 ›› 2022, Vol. 24 ›› Issue (4) : 74 -84. DOI: 10.15302/J-SSCAE-2022.04.008
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我国后端电子制造装备及其关键零部件发展研究

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Back-End Electronics Manufacturing Equipment in China and Their Key Components

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摘要

电子制造产业是我国经济的战略性、基础性、先导性支柱产业,在当前世界电子制造产业重塑供应链、生态链的变革期,开展后端电子制造装备及其关键零部件发展研究在支持相关产业高质量发展方面具有重要价值。本文梳理了国内外电子工业后端制造装备产业的发展现状与趋势,概括了电子器件“高密度、微型化”,制造过程“高效率、低成本”等国际技术竞争特征,凝练了我国电子制造装备行业面临的自主基础技术薄弱、市场竞争模式单一、进口依赖严重等问题,从关键工艺、核心装备及零部件角度着手,整理出我国亟待重点攻关的12类主要技术领域及其基本内容。为更准确地了解我国电子后端制造产业的过程与状态,本文选取了4家具有代表性的大、中、小型电子制造企业进行实证分析,总结了其各自发展战略和发展经验,明确了坚持创新联动、掌握关键技术、努力创造市场迭代机会等对于企业发展的重要性。最后,本文从顶层设计、产业布局、市场竞争、企业发展、技术创新、人才培养等层面,提出了我国电子后端制造装备及其关键零部件的发展建议,以期为相关行业高质量发展提供参考。

Abstract

Electronics manufacturing is a pillar industry of strategic importance for China’s economy. As the supply and ecological chains of global electronics manufacturing industry are currently being reshaped, conducting research on back-end electronics manufacturing equipment and their key components becomes extremely important for the high-quality development of the electronics manufacturing industry in China. This study analyzed the development status and trends of the back-end electronics manufacturing equipment industry in China and abroad and summarized the international technological competition characteristics of the industry, that is, the pursuit of high density and miniaturization of electronic devices as well as high efficiency and low cost in the manufacturing process. The electronics manufacturing equipment industry of China faces problems such as weakness in independent and fundamental technologies, a single market competition model, and severe dependence in imports. Additionally, 12 major technical fields and fundamental contents that China needs to focus on were summarized from the aspects of key processes, core equipment, and components. Empirical analysis was conducted on four typical electronics manufacturing enterprises to summarize their development strategies and experiences. The significance of innovation, key technologies, and market iteration for the development of related enterprises were clarified. Furthermore, corresponding countermeasures for the development of China’s back-end electronics manufacturing equipment and their components were proposed from the aspects of top-level design, industrial layout, market competition, enterprise development, technological innovation, and talent training.

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关键词

后端电子制造 / 供应链重塑 / 电子制造装备 / 多芯片器件集成 / 企业案例

Key words

后端电子制造 / 供应链重塑 / 电子制造装备 / 多芯片器件集成 / 企业案例 / back-end electronics manufacturing / supply chain reshaping / electronics manufacturing equipment / multi-chip device integration / enterprise case

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陈新,陈云,陈桪,吴小节. 我国后端电子制造装备及其关键零部件发展研究[J]. 中国工程科学, 2022, 24(4): 74-84 DOI:10.15302/J-SSCAE-2022.04.008

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中国工程院咨询项目“电子工业后端制造装备及其关键零部件卡脖子的关键基础和产业链的短板问题实证研究”

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