高性能存储芯片产业发展研究

孟柳

中国工程科学 ›› 2025, Vol. 27 ›› Issue (1) : 142-149.

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中国工程科学 ›› 2025, Vol. 27 ›› Issue (1) : 142-149. DOI: 10.15302/J-SSCAE-2024.10.053
全球未来网络领域发展趋势及我国开辟新领域新赛道战略研究

高性能存储芯片产业发展研究

作者信息 +

Development of High-Performance Memory Chip Industry

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摘要

高性能存储芯片堪称全球人工智能蓬勃发展的核心驱动力,不仅有力推动了信息技术产业不断迈进、显著提升电子设备性能、为服务器和数据中心的发展注入强劲动力,还极大促进了人工智能与机器学习、物联网、虚拟现实以及增强现实等新兴技术的崛起。本文全面系统地梳理了我国高性能存储芯片的发展需求,分析了高性能存储芯片的国际发展态势,总结了我国高性能存储芯片的发展现状,深入剖析了发展进程中所面临的问题与挑战,精准指出其带来的变革机遇,并提出以下针对性的对策建议:一是分层施策夯基础,变革策略求突破;二是传统新型两手抓,多条路线齐头并进;三是加速形成新技术布局,逐渐打破市场层垄断,期望能够加速我国高性能存储芯片的发展进程。

Abstract

High-performance storage chips are the core driving force underlying the robust expansion of global artificial intelligence. They are crucial for promoting the information technology industry, improving the performance of electronic devices, driving the evolution of servers and data centers, and fostering nascent technologies such as artificial intelligence, machine learning, the Internet of Things, virtual reality, and augmented reality. This study explores the essence of high-performance storage chips and sorts out their development requirements and international development trend. Moreover, it summarizes the development status of high-performance storage chips in China, delves into the problems and challenges encountered, and pinpoints the transformative opportunities. Furthermore, it proposes the following policy suggestions: (1) implementing a stratified approach to solidify the foundation while revolutionizing strategies to strive for breakthroughs; (2) stressing on both traditional and novel technologies and pursuing parallel development along multiple pathways; and (3) accelerating the establishment of a novel technological framework to progressively break the market monopoly.

关键词

高性能存储芯片 / 人工智能 / 数据中心 / 安全存储

Keywords

high-performance memory chips / artificial intelligence / data center / secure storage

引用本文

导出引用
孟柳. 高性能存储芯片产业发展研究. 中国工程科学. 2025, 27(1): 142-149 https://doi.org/10.15302/J-SSCAE-2024.10.053

参考文献

[1]
卜伟海, 夏志良, 赵治国, 等‍‍. 后摩尔时代集成电路产业技术的发展趋势 [J]‍. 前瞻科技, 2022, 1(3): 20‒41‍.
Bu W H, Xia Z L, Zhao Z G, et al‍. Development of integrated circuit industrial technologies in the post-Moore era [J]‍. Science and Technology Foresight, 2022, 1(3): 20‒41‍.
[2]
陈占良, 金龙旭, 陶宏江, 等‍. 高速图像压缩系统中DDR3控制器的实现 [J]‍. 电光与控制, 2016, 23(8): 85‍.
Chen Z L, Jin L X, Tao H J, et al‍. Implementation of DDR3 controller in high-speed image compression system [J]‍. Electronics Optics & Control, 2016, 23(8): 85‍.
[3]
陈夏琳, 胡铁军, 沈国亮‍. 新形势下提升我国集成电路产业链安全发展质效的对策建议 [J]‍. 电子产品世界, 2023, 30(7): 112‒116‍.
Chen X L, Hu T J, Shen G L‍. Suggestions to improve the quality and efficiency of the safe development of integrated circuit industry chain under new circumstances [J]‍. Electronic Engineering & Product World, 2023, 30(7): 112‒116‍.
[4]
邵微, 梁红波‍. 光刻技术的挑战和解决思路 [J]‍. 精细与专用化学品, 2021, 29(4): 1‒4‍.
Shao W, Liang H B‍. Challenges and solutions of lithography [J]‍. Fine and Specialty Chemicals, 2021, 29(4): 1‒4‍.
[5]
李钢, 李繁荣, 程健‍. 应用场景需求: 驱动人工智能芯片设计发展 [J]‍. 前沿科学, 2018, 12(4): 37‒40‍.
Li G, Li F R, Cheng J‍. Application scenario requirements: Driving the development of artificial intelligence chip design [J]‍. Frontier Science, 2018, 12(4): 37‒40‍.
[6]
孙宝德, 疏达, 付华栋, 等‍. 高端新材料智能制造的发展机遇与方向 [J]‍. 中国工程科学, 2023, 25(3): 152‒160‍.
Sun B D, Shu D, Fu H D, et al‍. Intelligent manufacturing for high-end new materials: Opportunities and directions [J]‍. Strategic Study of CAE, 2023, 25(3): 152‒160‍.
[7]
孔利媛, 宋征, 朱涛‍. 基于光电磁混合存储与区块链技术的电子存证研究 [J]‍. 电子技术与软件工程, 2020 (18): 176‒177‍.
Kong L Y, Song Z, Zhu T‍. Research on electronic deposit certificate based on photoelectromagnetic hybrid storage and blockchain technology [J]‍. Electronic Technology & Software Engineering, 2020 (18): 176‒177‍.
[8]
张敬锋, 刘琼, 李磊‍. Hadoop与ETL技术在视频数据中的应用 [J]‍. 警察技术, 2018 (5): 27‒29‍.
Zhang J F, Liu Q, Li L‍. The application of hadoop and ETL technology in video data [J]‍. Police Technology, 2018 (5): 27‒29‍.
[9]
赛娜‍. 基于边缘计算的超高清VR实验室系统研究与设计 [J]‍. 广播电视信息, 2024, 31(1): 70‒72‍.
Sai N‍. Research and design of ultra HD VR lab system based on edge computing [J]‍. Radio & Television Information, 2024, 31(1): 70‒72‍.
[10]
Huang Y F, Lin B, Xu Z H, et al‍. Research progress on cell structure optimization based on low-voltage SRAM [J]‍. Integrated Circuit Applications, 2023, 40(3): 1–3‍.
[11]
张蜀平, 郑宏宇‍. 电子封装技术的新进展 [J]‍. 电子与封装, 2004, 4(1): 3‒9‍.
Zhang S P, Zheng H Y‍. New progress of electronic packaging technology [J]‍. Electronics & Packaging, 2004, 4(1): 3‒9‍.
[12]
迈克. 硅谷群星扮靓电子风云 [J]‍. 电子设计应用, 2007 (4): 136‒139‍.
Mike‍. Silicon valley stars shine in the electronic world [J]‍. Electronic Design & Application, 2007 (4): 136‒139‍.
[13]
金健‍. 基于Nand Flash的嵌入式文件系统设计 [J]‍. 电脑知识与技术(学术交流), 2007, 4(22): 1053‒1055‍.
Jin J‍. The design of embedded file system based on nand flash [J]‍. Computer Knowledge and Technology, 2007, 4(22): 1053‒1055‍.
[14]
Lou P‍. Method for dynamic monitoring of NAND FLASH status in power collection concentrators [J]‍. Digital Users, 2019, 25(51): 95‍.
[15]
Liang Y‍. Changes in advertising strategies from the perspective of product life cycle [J]‍. Journal of Guangxi University (Philosophy and Social Sciences Edition), 2007 (S1): 270–271‍.
[16]
Hu P‍. Micron focuses on NAND flash market, aiming for top three globally [J]‍. China Integrated Circuit, 2006 (4): 76–77‍.
[17]
蒋颖昕‍.基于高带宽内存的高效图计算缓存架构研究 [D]‍. 武汉: 华中科技大学(硕士学位论文), 2022‍.
Jiang Y X‍. Research on efficient graph computing cache architecture based on high bandwidth memory [D]‍. Wuhan:Huazhong University of Science and Technology (Master's thesis), 2022‍.
[18]
Xian F‍. Introduction to chip packaging technology [J]‍. Semiconductor Technology, 2004 (8): 49–52‍.
[19]
张轶, 刘伟‍. 高新技术产业聚集效应研究 [J]‍. 中国商贸, 2009 (7): 159‍.
Zhang Y, Liu W‍. Study on agglomeration effect of high-tech industries [J]‍. China Business & Trade, 2009 (7): 159‍.
[20]
穆强‍. 存储器进入后PC时代 [J]‍. 电子设计技术, 2003, 10(12): 36‍.
Mu Q‍. Memory enters post-PC era [J]‍. EDN China, 2003, 10(12): 36‍.
[21]
李川, 郑浩, 王彦辉‍. 硅转接层高带宽存储互连通道信号完整性设计及仿真 [J]‍. 计算机工程与科学, 2022, 44(2): 199‒206‍.
Li C, Zheng H, Wang Y H‍. Design and analysis of high-bandwidth memory channel on silicon interposer [J]‍. Computer Engineering & Science, 2022, 44(2): 199‒206‍.
[22]
张智祥, 王贤军, 梁洁波‍. 如何推动中国数据存储产业高质量发展 [J]‍. 中国经济报告, 2023 (1): 82‒92‍.
Zhang Z X, Wang X J, Liang J B‍. How to promote the high-quality development of China's data storage industry [J]‍. China Policy Review, 2023 (1): 82‒92‍.
[23]
张健‍. 德清: 以"链长制"为抓手 [J]‍. 经贸实践, 2022 (11): 30‍.
Zhang J‍. Deqing: Taking "chain length system" as the starting point [J]‍. Economic Practice, 2022 (11): 30‍.
[24]
王正华‍. "中芯国际" 的发展道路——中芯国际的发展模式应该是我国集成电路企业发展的样板 [J]‍. 中国集成电路, 2004, 13(12): 77‒81‍.
Wang Z H‍. The development path of SMIC—The development model of SMIC should be a model for the development of IC enterprises in China [J]‍. China Integreted Circuit, 2004, 13(12): 77‒81‍.
[25]
韩丽‍.探究大宗贸易供应链对企业资金周转期的要求 [J]‍.今日财富, 2024 (15):20–22‍.
Han L‍. Research on the requirements of bulk trade supply chains for the working capital turnover period of enterprises [J]‍. Today's Fortune, 2024 (15): 20–22‍.
[26]
周观平, 易宇‍. 新发展格局下提升中国集成电路产业链安全可控水平研究 [J]‍. 宏观经济研究, 2021 (11): 58‒69‍.
Zhou G P, Yi Y‍. A study on improving the security and control level of China's IC industry chain under the new development pattern [J]‍. Macroeconomics, 2021 (11): 58‒69‍.
[27]
高青松, 刘惠玲‍. 全球供应链深度互嵌下芯片产业关键节点的产业链安全研究 [J]‍. 经济论坛, 2020 (3): 11‒21‍.
Gao Q S, Liu H L‍. Research on industrial chain security of key nodes in the chip industry with deeply interconnected global supply chain [J]‍. Economic Forum, 2020 (3): 11‒21‍.
[28]
王明辉‍. 基于产业链的纵向协同创新模式研究 [J]‍. 现代管理科学, 2015 (8): 57‒59‍.
Wang M H‍. Research on vertical collaborative innovation mode based on industrial chain [J]‍. Modern Management Science, 2015 (8): 57‒59‍.
[29]
曾昶‍. 新形势下种子管理工作中存在的问题及其对策分析 [J]‍. 河北农机, 2024 (5): 103‒105‍.
Zeng C‍. Problems and countermeasures in seed management under the new situation [J]‍. Hebei Agricultural Machinery, 2024 (5): 103‒105‍.
[30]
周明智, 朱烨圣‍. 企业并购协同效应研究——以三一重工收购德国普茨迈斯特公司为例 [R]‍. 武汉: 中国会计学会高等工科院校分会学术年会, 2015‍.
Zhou M Z, Zhu Y S‍. Research on the synergy effect of enterprise mergers and acquisitions—Taking the case of Sany Heavy Industry's acquisition of Putzmeister in Germany as an example [R]‍. Wuhan: Academic Annual Meeting of the Higher Engineering College Branch of the Chinese Accounting Society, 2015‍.
基金
中国工程院咨询项目“全球未来信息产业发展趋势及我国开辟新领域新赛道战略研究”(2023-XBZD-21)
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