针对半导体材料、器件生产工艺中的废气和废水的治理，介绍了三种不同的方法和相关设备。①利用碘盐、铜盐和锰盐以及多级逆向喷淋的设备对实验室MOVPE工艺尾气及砷化镓材料制备中砷烷、磷烷污染的治理。②生产规模的半导体材料砷化镓，磷化姻，重掺砷硅单晶材料及器件的工艺中，腐蚀间排放的废气中砷、磷、硫、氟、氯及氮氧化物酸根离子的治理。用椭圆隔板式喷淋吸收塔或双塔式喷淋吸收设备，用氧化剂及碱液吸收的治理方法。③治理半导体工艺废水中砷、总磷、各种酸及重金属等的污染。用碳酸钙中和后，加铁盐经絮凝沉降一体化装置治理废水。经治理后的废气、废水经环保部门检测均达到国家排放标准^[1-3]。

The purpose of this article is to examine the methods and equipments for abating waste gases and water produced during the manufacture of semiconductor materials and devices. Three methods and equipments are presented in this article to control three different groups of electronic wastes. The first group includes arsine and phosphine emitted during the manufacture in semiconductor materials. The abatement procedure for this group of pollutants consists in adding iodates, cupric and manganese salts to a multiple shower tower (MST) structure. The second group includes pollutants containing arsenic, phosphorus, HF, HCl, NO₂ and SO₃ emitted during the manufacture of semiconductor materials and devices. The abatement procedure involves mixing oxidants and alkali liquor in an oval column with a separator in the middle. The third group consists of the ions of As, P and heavy metals contained in the waste water. The abatement procedure includes adding CaCO₃ and ferric salts into the waste water in a flocculation-sedimentation compact device. Test results showed that all waste gases and water after the abatement presented in this article passed the effluent standards set by the National Environmental Protection Bureau. ^[1]