对静电键合、体硅直接键合和界面层辅助键合等三种体硅键合技术，整片操作、局部操作和选择保护等三种密封技术，以及这些技术用于微电子机械系统的密封作了评述，强调在器件研究开始时应考虑封装问题，具体技术则应在保证器件功能和尽量减少芯片复杂性两者之间权衡决定。

The packaging of micro electro mechanical systems (MEMS) is referred to first-level packaging and limited generally to the preservation of wafer in this paper. It is based on bulk silicon bonding technology and film sealed technology. The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfacial layer assisted bonding. It is used for making material acting as substrate or cover of the chip. The film sealed technology includes whole-wafer operation, local-wafer operation and selective preservation. It is used to seal micro channel or micro hole to form a vacuum or low-pressure cavity or protect from atmosphere influence. The very high importance not to forget packaging at the beginning of a project, when hoping to industrialize MEMS is discussed. In order to obtain high performance-price ratio,it is necessary to weigh the device performance against the chip complexity. The commercialized pressure sensors, accelerometers, digital micro mirror devices, etc., collected from literatures are used as examples.