2022, Volume 24, Issue 4
Strategic Study of CAE >> 2022, Volume 24, Issue 4 doi: 10.15302/J-SSCAE-2022.04.008
Back-End Electronics Manufacturing Equipment in China and Their Key Components
1. School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China;
2. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China
Next Previous
Abstract
Electronics manufacturing is a pillar industry of strategic importance for China’s economy. As the supply and ecological chains of global electronics manufacturing industry are currently being reshaped, conducting research on back-end electronics manufacturing equipment and their key components becomes extremely important for the high-quality development of the electronics manufacturing industry in China. This study analyzed the development status and trends of the back-end electronics manufacturing equipment industry in China and abroad and summarized the international technological competition characteristics of the industry, that is, the pursuit of high density and miniaturization of electronic devices as well as high efficiency and low cost in the manufacturing process. The electronics manufacturing equipment industry of China faces problems such as weakness in independent and fundamental technologies, a single market competition model, and severe dependence in imports. Additionally, 12 major technical fields and fundamental contents that China needs to focus on were summarized from the aspects of key processes, core equipment, and components. Empirical analysis was conducted on four typical electronics manufacturing enterprises to summarize their development strategies and experiences. The significance of innovation, key technologies, and market iteration for the development of related enterprises were clarified. Furthermore, corresponding countermeasures for the development of China’s back-end electronics manufacturing equipment and their components were proposed from the aspects of top-level design, industrial layout, market competition, enterprise development, technological innovation, and talent training.
Keywords
back-end electronics manufacturing ; supply chain reshaping ; electronics manufacturing equipment ; multi-chip device integration ; enterprise case
Figures
Fig. 1
References
[ 1 ] Xiao H. Improve the level of electronic information technology standards, and enhance the ability to serve and promote industrial development [J]. Information Technology & Standardization, 2010 (12): 10‒11. Chinese.
[ 2 ] China Federation of Electronics and Information Industry. Report on economic operation of China’s electronic information industry (2020) [R]. Beijing: China Federation of Electronics and Information Industry, 2020. Chinese.
[ 3 ] Ying J Y. Status quo, motives and policy implications of China’s industrial transfer [J]. Modern SOE Research, 2021 (Z1): 74‒77. Chinese.
[ 4 ] Luo J X, Hu Y M. Technology roadmap of electronic information manufacturing equipment industry for Guangdong province [M]. Guangzhou: South China University of Technology Press, 2017. Chinese.
[ 5 ] Du J Z. Security risk analysis and suggestions for the application of new technologies in intelligent manufacturing [J]. China Information Security, 2021 (1): 39‒41. Chinese.
[ 6 ] Hu H P, Yuan Y, Wang Z D. Transfer mechanism, characteristics and countermeasures of global emerging industries in the back‐ ground of economic and trade frictions between China and America [J]. Science Technology and Industry, 2021, 21(5): 174‒177. Chinese.
[ 7 ] Yu D. In the post-epidemic era, China is the first choice for global industrial chain transfer [J]. China’s Foreign Trade, 2021 (4): 20‒21. Chinese.
[ 8 ] Reference News. Ranking of the global electronics industry: China 37.2% surpasses the United States and ranks first [EB/OL]. (2019-07-31) [2022-06-18]. Chinese. link1
[ 9 ] Liu S. Development and application of numerical control technology [J]. Fujian Chemical Industry, 2010 (10): 147‒148. Chinese.
[10] Pan Z W. Research on the development concepts of integrated circuit manufacturing industry [J]. Telecom World, 2017 (2): 156‒157. Chinese.
[11] Zhang G M. New opportunities for the development of domestic integrated circuit manufacturing equipment in the time of intelli‐ gence [J]. Applications of IC, 2018, 35 (1): 56‒57. Chinese.
[12] Zhao Z J, Zhang D, Li J X. Vigorously promote the rapid develop‐ ment of intelligent manufacturing of high-end electronic equipment in my country [J]. Defence Science & Technology Industry, 2019 (5): 38‒41. Chinese.
[13] Chen Y, Chen Y H, Long J Y, et al. Achieving a sub-10 nm nano‐ pore array in silicon by metal-assisted chemical etching and machine learning [J]. International Journal of Extreme Manufacturing, 2021, 3(3): 35104. Chinese.
[14] Chen X. Design theory and system development of precision microelectronic packaging equipment [M]. Beijing: Machinery Industry Press, 2018. Chinese.
[15] Chen X, Jiang Y J, Tan Y T, et al. Progress and application of key technologies on the electronic packaging equipment development [J]. Journal of Mechanical Engineering, 2017, 53(5): 181‒189. Chinese.
京公网安备 11010502051620号
