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Zilian QU,Yonggang MENG,Qian ZHAO
《机械工程前沿(英文)》 2015年 第10卷 第1期 页码 1-6 doi: 10.1007/s11465-015-0325-2
This paper proposes a new eddy current method, named equivalent unit method (EUM), for the thickness measurement of the top copper film of multilayer interconnects in the chemical mechanical polishing (CMP) process, which is an important step in the integrated circuit (IC) manufacturing. The influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent film thickness. By subtracting this equivalent film component, the accuracy of the thickness measurement of the top copper layer with an eddy current sensor is improved and the absolute error is 3 nm for sampler measurement.
关键词: CMP eddy current multilayer wafer Cu interconnects equivalent unit
Qing-hua He,De-lei Yang,Yong-kui Li,Lan Luo
《工程管理前沿(英文)》 2015年 第2卷 第2期 页码 148-153 doi: 10.15302/J-FEM-2015024
关键词: construction megaproject (CMP) organizational citizenship behavior connotation grounded theory
标题 作者 时间 类型 操作
Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process
Zilian QU,Yonggang MENG,Qian ZHAO
期刊论文