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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3,   Pages 559-569 doi: 10.1007/s11465-020-0624-0

Abstract: Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of siliconwafers.Grinding experiments using coarse and fine resin-bond diamond grinding wheels were performed on silicon wafersResults showed that taping in backgrinding could provide effective protection for ground wafers fromThe PV value of silicon wafers with taping decreased with increasing mesh size of the grinding wheel

Keywords: taping     silicon wafer     backgrinding     subsurface damage     surface roughness    

450 mm Silicon Wafers Are Imperative for Moore's Law but maybe Postponed

Hailing Tu

Engineering 2015, Volume 1, Issue 2,   Pages 162-163 doi: 10.15302/J-ENG-2015060

Behavior of Impurities, Defects and Surface Morphology for Silicon and Silicon Based Semiconducting Materials

Tu Hailing

Strategic Study of CAE 2000, Volume 2, Issue 1,   Pages 7-17

Abstract: considerations, the major wafer sizes are shifting to 150mm and 200mm, and the mass production of 300mm diameter wafersConsequently, on one hand, the growth and manufacturing of large diameter crystals and wafers bring about

Keywords: silicon wafers     epitaxial silicon wafers     SiGe     silicon-on-insulator (SOI)     impurities behavior     defects control    

High-quality industrial n-type silicon wafers with an efficiency of over 23% for Si heterojunction solar

Fanying MENG,Jinning LIU,Leilei SHEN,Jianhua SHI,Anjun HAN,Liping ZHANG,Yucheng LIU,Jian YU,Junkai ZHANG,Rui ZHOU,Zhengxin LIU

Frontiers in Energy 2017, Volume 11, Issue 1,   Pages 78-84 doi: 10.1007/s11708-016-0435-5

Abstract: n-type CZ-Si wafers featuring longer minority carrier lifetime and higher tolerance of certain metalIn this study, Si heterojuction (SHJ) solar cells which was fabricated with different wafers in the top

Keywords: n-type Cz-Si     thinner wafer     surface texture     high efficiency     SHJ solar cell    

Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Strategic Study of CAE 2023, Volume 25, Issue 1,   Pages 68-78 doi: 10.15302/J-SSCAE-2023.01.002

Abstract:

Silicon wafers are fundamental materials for semiconductors.China's semiconductor silicon wafers are highly dependent on foreign trade.Enhancing the independent guarantee capability of silicon wafers is significant for improving the overallThis study focuses on the market-dominant 8-inch and 12-inch silicon wafers, analyzes the developmentsupporting the coordinated development of the industrial chain, and (4) developing semiconductor silicon wafers

Keywords: semiconductor silicon wafer     8 inches     12 inches     industry synergy     advanced processing    

Title Author Date Type Operation

Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Journal Article

450 mm Silicon Wafers Are Imperative for Moore's Law but maybe Postponed

Hailing Tu

Journal Article

Behavior of Impurities, Defects and Surface Morphology for Silicon and Silicon Based Semiconducting Materials

Tu Hailing

Journal Article

High-quality industrial n-type silicon wafers with an efficiency of over 23% for Si heterojunction solar

Fanying MENG,Jinning LIU,Leilei SHEN,Jianhua SHI,Anjun HAN,Liping ZHANG,Yucheng LIU,Jian YU,Junkai ZHANG,Rui ZHOU,Zhengxin LIU

Journal Article

Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Journal Article