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Effects of taping on grinding quality of silicon wafers in backgrinding
Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO
Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3, Pages 559-569 doi: 10.1007/s11465-020-0624-0
Keywords: taping silicon wafer backgrinding subsurface damage surface roughness
450 mm Silicon Wafers Are Imperative for Moore's Law but maybe Postponed
Hailing Tu
Engineering 2015, Volume 1, Issue 2, Pages 162-163 doi: 10.15302/J-ENG-2015060
Tu Hailing
Strategic Study of CAE 2000, Volume 2, Issue 1, Pages 7-17
Keywords: silicon wafers epitaxial silicon wafers SiGe silicon-on-insulator (SOI) impurities behavior defects control
Fanying MENG,Jinning LIU,Leilei SHEN,Jianhua SHI,Anjun HAN,Liping ZHANG,Yucheng LIU,Jian YU,Junkai ZHANG,Rui ZHOU,Zhengxin LIU
Frontiers in Energy 2017, Volume 11, Issue 1, Pages 78-84 doi: 10.1007/s11708-016-0435-5
Keywords: n-type Cz-Si thinner wafer surface texture high efficiency SHJ solar cell
Progress and Prospect of Semiconductor Silicon Wafers in China
Zhang Guohu, Xiao Qinghua, Ma Fei
Strategic Study of CAE 2023, Volume 25, Issue 1, Pages 68-78 doi: 10.15302/J-SSCAE-2023.01.002
Silicon wafers are fundamental materials for semiconductors.China's semiconductor silicon wafers are highly dependent on foreign trade.Enhancing the independent guarantee capability of silicon wafers is significant for improving the overallThis study focuses on the market-dominant 8-inch and 12-inch silicon wafers, analyzes the developmentsupporting the coordinated development of the industrial chain, and (4) developing semiconductor silicon wafers
Keywords: semiconductor silicon wafer 8 inches 12 inches industry synergy advanced processing
Title Author Date Type Operation
Effects of taping on grinding quality of silicon wafers in backgrinding
Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO
Journal Article
Behavior of Impurities, Defects and Surface Morphology for Silicon and Silicon Based Semiconducting Materials
Tu Hailing
Journal Article
High-quality industrial n-type silicon wafers with an efficiency of over 23% for Si heterojunction solar
Fanying MENG,Jinning LIU,Leilei SHEN,Jianhua SHI,Anjun HAN,Liping ZHANG,Yucheng LIU,Jian YU,Junkai ZHANG,Rui ZHOU,Zhengxin LIU
Journal Article