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crack-face conditions 1

intensity factors 1

non-flat cracks 1

permittivity 1

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Investigation of Generalized SIFs of cracks in 3D piezoelectric media under various crack-face conditions

Jaroon RUNGAMORNRAT, Bounsana CHANSAVANG, Weeraporn PHONGTINNABOOT, Chung Nguyen VAN

Frontiers of Structural and Civil Engineering 2020, Volume 14, Issue 2,   Pages 280-298 doi: 10.1007/s11709-019-0586-7

Abstract: This paper investigates the influence of crack geometry, crack-face and loading conditions, and the permittivity of a medium inside the crack gap on intensity factors of planar and non-planar cracks in linear piezoelectric media. A weakly singular boundary integral equation method together with the near-front approximation is adopted to accurately determine the intensity factors. Obtained results indicate that the non-flat crack surface, the electric field, and the permittivity of a medium inside the crack gap play a crucial role on the behavior of intensity factors. The mode-I stress intensity factors ( ) for two representative non-planar cracks under different crack-face conditions are found significantly different and they possess both upper and lower bounds. In addition, for impermeable and semi-permeable non-planar cracks treated depends strongly on the electric field whereas those of impermeable, permeable, and semi-permeable penny-shaped cracks are identical and independent of the electric field. The stress/electric intensity factors predicted by permeable and energetically consistent models are, respectively, independent of and dependent on the electric field for the penny-shaped crack and the two representative non-planar cracks. Also, the permittivity of a medium inside the crack gap strongly affects the intensity factors for all crack configurations considered except for of the semi-permeable penny-shaped crack.

Keywords: crack-face conditions     intensity factors     non-flat cracks     permittivity     piezoelectric media     SGBEM    

Title Author Date Type Operation

Investigation of Generalized SIFs of cracks in 3D piezoelectric media under various crack-face conditions

Jaroon RUNGAMORNRAT, Bounsana CHANSAVANG, Weeraporn PHONGTINNABOOT, Chung Nguyen VAN

Journal Article