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《工程(英文)》 >> 2023年 第23卷 第4期 doi: 10.1016/j.eng.2022.07.021

关于后摩尔时代我国集成电路制造领域的一些思考

School of Micro-Nano Electronics, Zhejiang University, Hangzhou 310058, China

收稿日期: 2022-08-01 修回日期: 2022-09-26 录用日期: 2022-12-05 发布日期: 2023-01-04

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参考文献

[ 1 ] He Y, Zhou W, Qian G, Chen B. Methane storage in metal‒organic frameworks. Chem Soc Rev 2014;43(16):5657‒78. JonesH. Semiconductor market by product [presentation]. In: Industry strategy symposium; 2020 Jan 12‒15; Halfmoon Bay, CA, USA; 2020. 链接1

[ 2 ] Moore GE. Cramming more components onto integrated circuits. Electronics 1998;86(1):82‒5. 链接1

[ 3 ] Moore GE. Progress in digital integrated electronics. In: Proceedings of International Electronics Devices Meeting; 1975 Dec 1‒3; Washington, DC, USA; 1975.

[ 4 ] Wang Y. Complete book of integrated circuit industry. Beijing: Publishing House of Electronics Industry; 2018. Chinese.

[ 5 ] Hwang C. TSMC dossier (4): technology contention among world-class leaders [Internet]. Taipei: Digitimes; 2021 Jul 13 [cited 2021 Sep 18]. Available from: https://www.digitimes.com/news/a20210713VL201.html. 链接1

[ 6 ] Jones SW. Technology and cost trends at advanced nodes. Report. Georgetown: IC Knowledge LLC; 2021 Jan.

[ 7 ] Gu W. Research report of China fabless IC industry. Report. Shanghai: Xinmou Research; 2021 Feb. 链接1

[ 8 ] Wu H, Yu S. Research on science and technology development of electronic information engineering in China: special topics on integrated circuit industry. Beijing: Science Press (Beijing); 2019. Chinese.

[ 9 ] Wu H, Yu S. Research on science and technology development of electronic information engineering in China: special topics on integrated circuit manufacturing process. Beijing: Science Press (Beijing); 2019. Chinese.

[10] Norwood A. Market share analysis: semiconductors, worldwide, 2018. Report. Stamford: Gartner; 2019 Apr.

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