2000年 第2卷 第3期
影响微电子机械系统成品率和可靠性和粘合力和磨擦力
中国科学院上海冶金研究所，上海 200050
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摘要
文章评述了影响微电子机械系统（MEMS)成品率和可靠性的粘合力和摩擦力问题。在用氢氟酸(HF)腐蚀牺牲层、释放多晶Si微结构、干燥时，由于Si片表面薄层水的表面张力使两片亲水、间隙在微米量级的a片粘合起来，称为“释放有关粘合”。粘合也发生在封装后器件中，当输入信号过冲时，由于Si片表面的化学状态将Si片粘合起来，称为“使用中粘合”。解决粘合的最好办法是：在MEMS微结构的表面涂以抗粘合薄膜，将成品器件在干燥气氛下封装。介绍了抗粘合薄膜的制备工艺和目前存在的问题。相比之下，具有高速运动的MEMS,其摩擦力问题更为复杂。应用抗粘合薄膜，解决了粘合，也降低了摩擦力，但摩擦依然存在。摩擦带来磨损，降低器件可靠性和寿命。寻找既抗粘合、又耐磨的薄膜，是解决高速运动MEMS可靠性和寿命的一个关键。
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