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MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
《机械工程前沿（英文）》 2017年 第12卷 第4期 页码 557-566 doi: 10.1007/s11465-017-0441-2
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.
关键词： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package
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