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微机电系统 3

CMOS；跨导提升技术；低噪声放大器；变压器；共栅级 1

仪器仪表 1

仿生智能技术 1

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弯曲结构表面；柔性加速度计；微机电系统（MEMS）技术；无线非接触式测量 1

微力传感器 1

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摩尔定律；高效节能技术；神经网络加速器；超CMOS器件 1

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

《机械工程前沿（英文）》 2017年第12卷第4期页码 557-566 doi: 10.1007/s11465-017-0441-2

摘要：

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

关键词： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

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Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

《机械工程前沿（英文）》 2017年第12卷第4期页码 457-458 doi: 10.1007/s11465-017-0492-4

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Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

《机械工程前沿（英文）》 2017年第12卷第4期页码 490-509 doi: 10.1007/s11465-017-0484-4

摘要：

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the . The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

关键词： direct-write additive manufacturing microfabrication MEMS

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Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

《机械工程前沿（英文）》 2017年第12卷第4期页码 526-538 doi: 10.1007/s11465-017-0451-0

摘要：

Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.

关键词： differential scanning calorimetry biomolecule MEMS thermodynamic

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Erratum to: Folded down-conversion mixer for a 60 GHz receiver architecture in 65-nm CMOS technology

Najam Muhammad AMIN,Zhi-gong WANG,Zhi-qun LI

《信息与电子工程前沿（英文）》 2015年第16卷第5期 doi: 10.1631/FITEE.14e0087

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A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

《机械工程前沿（英文）》 2023年第18卷第2期 doi: 10.1007/s11465-023-0747-1

摘要： Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10⁻⁷)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

关键词： micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement

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基于变压器CMOS超宽带毫米波电路分析与设计综述 Review Articles

Yi-ming YU, Kai KANG

《信息与电子工程前沿（英文）》 2020年第21卷第1期页码 97-115 doi: 10.1631/FITEE.1900491

摘要：近年来，由于大量毫米波无线应用的产生，具有更强通用性的宽带毫米波电路和系统引起广泛关注。总结了4种基于片上变压器结构超宽带毫米波电路的理论分析、设计方法和综合性能。其一为毫米波低噪声放大器，采用基于变压器的跨导增强和极点调谐技术；通过采用这两种技术，该电路同时实现了较大工作带宽、低噪声系数和良好功率增益。其二为毫米波注入锁定三倍频器，采用注入电流增强技术，有效拓展了倍频器的锁定带宽。进一步，采用类似注入锁定技术结合变压器高阶谐振腔方案，实现了一款超宽带毫米波注入锁定分频器。最后，介绍了一款E波段上混频器，其采用两路跨导并联结构和基于变压器的多极点负载，实现了优异线性度和较大工作带宽。

关键词：硅基集成电路；毫米波；超宽带；变压器；低噪声放大器；倍频器；分频器；混频器

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微系统研究的思考和单芯片RF-MEMS研究进展

钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良

《中国工程科学》 2004年第6卷第7期页码 21-25

摘要：文章阐述了微系统研究的意义以及微系统基础研究的重要性，概述了用于无线通信设备的MEMS器件的性能，指出了MEMS技术是最终实现单芯片机电一体化无线收发系统的根本途径之一，介绍了用于无线通信网络的单芯片机电一体化的微系统研究进展情况

关键词：微系统集成单芯片无线通信系统

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combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS

Ming-jun MA,Zhong-he JIN,Hui-jie ZHU

《信息与电子工程前沿（英文）》 2015年第16卷第6期页码 497-510 doi: 10.1631/FITEE.1400349

摘要： The bias drift of a micro-electro-mechanical systems (MEMS) accelerometer suffers from the 1/ noise and the temperature effect. For massive applications, the bias drift urgently needs to be improved. Conventional methods often cannot address the 1/ noise and temperature effect in one architecture. In this paper, a combined approach on closed-loop architecture modification is proposed to minimize the bias drift. The modulated feedback approach is used to isolate the 1/ noise that exists in the conventional direct feedback approach. Then a common mode signal is created and added into the closed loop on the basis of modulated feedback architecture, to compensate for the temperature drift. With the combined approach, the bias instability is improved to less than 13 μ , and the drift of the Allan variance result is reduced to 17 μ at 100 s of the integration time. The temperature coefficient is reduced from 4.68 to 0.1 m /°C. The combined approach could be useful for many other closed-loop accelerometers.

关键词： Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation

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基于电感和变压器跨导提升技术、噪声系数为3.2 dB、带宽为9.8–30.1 GHz的CMOS低噪声放大器

陈宏尘1,朱浩慎1,吴亮2,车文荃1,薛泉1

《信息与电子工程前沿（英文）》 2021年第22卷第4期页码 586-598 doi: 10.1631/FITEE.2000510

摘要：使用台积电（TSMC）65 nm CMOS工艺流片并测试，这款低噪声放大器最低噪声系数仅为3.2 dB，带宽高达20.3 GHz，适用于5G毫米波收发系统。本文提出的宽带毫米波低噪声放大器经台积电65纳米CMOS工艺流片加工。去除测试PAD后的芯片面积仅为0.1 μm2。该低噪声放大器采用在片测试方法测试。

关键词： CMOS；跨导提升技术；低噪声放大器；变压器；共栅级

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基于符号分析法的CMOS模拟单元电路自动优化技术

郑维山,邓青,刘朝霞,时龙兴

《中国工程科学》 2009年第11卷第4期页码 50-56

摘要：

在CMOS单元电路自动优化中提出了一个新的设计方法。

关键词：优化性能方程符号分析遗传算法

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高效节能计算的跨层设计：为实现每瓦特电力每秒千万亿次运算 Perspectives

Xiaobo Sharon HU, Michael NIEMIER

《信息与电子工程前沿（英文）》 2018年第19卷第10期页码 1209-1223 doi: 10.1631/FITEE.1800466

摘要：与此同时，越来越多证据表明，对于传统布尔电路和冯诺依曼处理器，超CMOS器件很难与CMOS技术竞争。为充分发挥超CMOS器件的优势，从器件到电路到体系结架再到算法的跨层设计工作不可或缺。

关键词：摩尔定律；高效节能技术；神经网络加速器；超CMOS器件

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Development and application of high-end aerospace MEMS

Weizheng YUAN

《机械工程前沿（英文）》 2017年第12卷第4期页码 567-573 doi: 10.1007/s11465-017-0424-3

摘要：

This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.

关键词： MEMS design and manufacture technology aeronautic and aerospace

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一种用于工业级荧光光纤温度传感器的栅控双向静电放电器件的设计与优化 Research Article

汪洋1,金湘亮1,杨健1,严峰1,刘煜杰1,彭艳2,罗均2,杨军3

《信息与电子工程前沿（英文）》 2022年第23卷第1期页码 158-170 doi: 10.1631/FITEE.2000504

摘要：工业级荧光光纤温度传感器读出电路的I/O引脚需要片上集成高性能静电放电（ESD）保护器件。采用0.18 μm标准BCD工艺制造的基本N型埋层栅控可控硅（NBL-GCSCR）失效等级难以满足需求。因此，基于相同半导体工艺，提出片上集成新型高失效等级深N阱栅控可控硅（DNW-GCSCR）以有效解决上述问题。采用技术计算机辅助设计（TCAD）仿真分析器件特性。可控硅通过传输线脉冲（TLP）进行测试，以获得准确ESD参数。具有纵向双极晶体管（BJT）路径的NBL-GCSCR维持电压（24.03 V）明显高于具有相同尺寸横向可控硅路径的DNW-GCSCR维持电压（5.15 V）。NBL-GCSCR器件的失效电流为1.71 A，DNW-GCSCR器件的失效电流为20.99 A。当DNW-GCSCR栅极尺寸从2 μm增加到6 μm时，维持电压为从3.50 V增加到8.38 V。优化后的DNW-GCSCR（栅极尺寸6 μm）可以稳定应用于目标读出电路的片上静电放电保护。

关键词：静电击穿；半导体器件可靠性；CMOS工艺

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

《机械工程前沿（英文）》 2006年第1卷第2期页码 238-241 doi: 10.1007/s11465-006-0011-5

摘要： Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, and bonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors. The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, and then Si-Au alloy bonding was formed by annealing at 400vH for 2 h. The air sealability of the cavity after bonding was finally tested using the N filling method. The results indicate that large bond strength was obtained at the bonding interface. This process was used in fabricating a pressure sensor with a sandwich structure. The results indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging.

关键词： Si/Au-glass strength MEMS packaging process sandwich structure