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Numerical analysis of hydrodynamic process of circular-translational-moving polishing (CTMP)

ZHAI Wenjie, LIU Changxiong, LIANG Yingchun

Frontiers of Mechanical Engineering 2008, Volume 3, Issue 4,   Pages 441-448 doi: 10.1007/s11465-008-0074-6

Abstract: without rotation, we developed a polishing technique called circular-translational-moving polishing (CTMPTo illuminate the mechanisms of CTMP and determine the optimum process variables in a CTMP process, athree-dimensional hydrodynamic lubrication model for CTMP with a smooth and rigid pad under a quasi-stableThe reason for negative pressure in CTMP and its effect on polishing is discussed.obtained numerical analysis can be used as guidance for choosing operation parameters in a practical CTMP

Keywords： numerical analysis     practical CTMP     circular-translational-moving polishing     CTMP     different    

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Numerical analysis of hydrodynamic process of circular-translational-moving polishing (CTMP)

ZHAI Wenjie, LIU Changxiong, LIANG Yingchun

Journal Article