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Fabrication of Si-based three-dimensional microbatteries: A review

Chuang YUE, Jing LI, Liwei LIN

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 459-476 doi: 10.1007/s11465-017-0462-x

Abstract:

High-performance, Si-based three-dimensional (3D) microbattery systems for powering micro/nano-electromechanical systems and lab-on-chip smart electronic devices have attracted increasing research attention. These systems are characterized by compatible fabrication and integratibility resulting from the silicon-based technologies used in their production. The use of support substrates, electrodes or current collectors, electrolytes, and even batteries used in 3D layouts has become increasingly important in fabricating microbatteries with high energy, high power density, and wide-ranging applications. In this review, Si-based 3D microbatteries and related fabrication technologies, especially the production of micro-lithium ion batteries, are reviewed and discussed in detail in order to provide guidance for the design and fabrication.

Keywords： three-dimensional (3D) wafer-scale Si-based anode micro-LIBs thin-film deposition

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Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

Frontiers in Energy 2017, Volume 11, Issue 1, Pages 1-3 doi: 10.1007/s11708-016-0436-4

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2, Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturePatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive intermediate layer patterned wafer bonding

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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3, Pages 559-569 doi: 10.1007/s11465-020-0624-0

Abstract: Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon wafers. Grinding experiments using coarse and fine resin-bond diamond grinding wheels were performed on silicon wafers with tapes of different thicknesses to investigate the effects of taping on peak-to-valley (PV), surface roughness, and subsurface damage of silicon wafers after grinding. Results showed that taping in backgrinding could provide effective protection for ground wafers from breakage. However, the PV value, surface roughness, and subsurface damage of silicon wafers with taping deteriorated compared with those without taping although the deterioration extents were very limited. The PV value of silicon wafers with taping decreased with increasing mesh size of the grinding wheel and the final thickness. The surface roughness and subsurface damage of silicon wafers with taping decreased with increasing mesh size of grinding wheel but was not affected by removal thickness. We hope the experimental finding could help fully understand the role of taping in backgrinding.

Keywords： taping silicon wafer backgrinding subsurface damage surface roughness

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

Keywords： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

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Structure controlling and process scale-up in the fabrication of nanomaterials

Chunzhong LI,

Frontiers of Chemical Science and Engineering 2010, Volume 4, Issue 1, Pages 18-25 doi: 10.1007/s11705-009-0305-3

Abstract: The research on process engineering and scale-up will be very important for the commercial productiontechnologies for magnetic powders, calcium carbonate, and titanium dioxide have been developed for commercial-scaleproduction, and the largest production scale has reached 15 kt/year.

Keywords： scale-up significant commercial electroanalytical engineering laboratory

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Large-scale App privacy governance

Frontiers of Engineering Management Pages 640-652 doi: 10.1007/s42524-022-0228-y

Abstract: As the number of Apps continuously increases, effective large-scale App governance is a major challengeIn this regard, we propose a quantitative method to filter out problematic Apps on a large scale.number of Apps under the levels given in the PL standard, which may provoke insights into the large-scale

Keywords： privacy risk Privacy Level quantification large-scale App governance

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On the added value of multi-scale modeling of concrete

Frontiers of Structural and Civil Engineering 2022, Volume 16, Issue 1, Pages 1-23 doi: 10.1007/s11709-021-0790-0

Abstract: This review of the added value of multi-scale modeling of concrete is based on three representative examplesThe structural nature of the high-dynamic strength increase can be explained by using a multi-scale modelThe second example refers to multi-scale thermoelastic analysis of concrete pavements, subjected to solarThe third example deals with multi-scale structural analysis of a real-scale test of a segmental tunnelOverall, it is concluded that multi-scale models have indeed a significant added value.

Keywords： experiments multi-scale analysis conventional structural analysis concrete reinforced concrete

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Large Scale Infrastructure Projects: The Art of Project or Change Management?

Geert Letens,Kurt Verweire,Peter De Prins

Frontiers of Engineering Management 2016, Volume 3, Issue 3, Pages 197-202 doi: 10.15302/J-FEM-2016033

Abstract: of managing projects in the construction industry in general and an inevitable challenge for large scaleReflections on the application of this model in the construction industry and in large scale infrastructure

Keywords： large scale project management organization development and change batteries of change model

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Large-scale model test study on the water pressure resistance of construction joints of karst tunnel

Frontiers of Structural and Civil Engineering Pages 1249-1263 doi: 10.1007/s11709-023-0974-x

Abstract: A large-scale model test was designed and conducted, innovatively transforming the external water pressure

Keywords： karst tunnel lining construction joint water pressure resistance large-scale model test numerical

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Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

Zilian QU,Yonggang MENG,Qian ZHAO

Frontiers of Mechanical Engineering 2015, Volume 10, Issue 1, Pages 1-6 doi: 10.1007/s11465-015-0325-2

Abstract:

This paper proposes a new eddy current method, named equivalent unit method (EUM), for the thickness measurement of the top copper film of multilayer interconnects in the chemical mechanical polishing (CMP) process, which is an important step in the integrated circuit (IC) manufacturing. The influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent film thickness. By subtracting this equivalent film component, the accuracy of the thickness measurement of the top copper layer with an eddy current sensor is improved and the absolute error is 3 nm for sampler measurement.

Keywords： CMP eddy current multilayer wafer Cu interconnects equivalent unit

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Stabilization treatment of contaminated soil: a field-scale application in Shanghai, China

Changbo ZHANG, Qishi LUO, Chunnu GENG, Zhongyuan LI

Frontiers of Environmental Science & Engineering 2010, Volume 4, Issue 4, Pages 395-404 doi: 10.1007/s11783-010-0271-5

Abstract: been used worldwide but is rarely used for treatment of contaminated sites in China despite many bench-scaleHere, a field-scale application of stabilization treatment in Shanghai, China was summarized to demonstratephase II ESA, quantitative human health risk assessment, remediation alternatives evaluation, bench-scale

Keywords： stabilization contaminated soil field-scale demonstration technical obstacles

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Progress and Prospect of Semiconductor Silicon Wafers in China

Zhang Guohu, Xiao Qinghua, Ma Fei

Strategic Study of CAE 2023, Volume 25, Issue 1, Pages 68-78 doi: 10.15302/J-SSCAE-2023.01.002

Abstract: inch and 12-inch silicon wafers, analyzes the development status of the global semiconductor silicon waferThe study specifically focuses on the development status of China's semiconductor silicon wafer industryhoping to provide a reference for the higher-quality development of China’s semiconductor silicon wafer

Keywords： semiconductor silicon wafer 8 inches 12 inches industry synergy advanced processing

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Investigation on the integral output power model of a large-scale wind farm

BAO Nengsheng, MA Xiuqian, NI Weidou

Frontiers in Energy 2007, Volume 1, Issue 1, Pages 67-78 doi: 10.1007/s11708-007-0006-x

Abstract: The integral output power model of a large-scale wind farm is needed when estimating the wind farm sThe calculation algorithms and steps of the integral output power model of a large-scale wind farm areThe characteristics of a large-scale wind farm are also discussed.

Keywords： power model actual energy large-scale practical measurement